The present disclosure is directed to a high throughput clip bonding tool or system which is flexible and easily adapts to different clip bond pitches or sizes. The clip bonding system may be an integrated system with various modules, including a clip singulation module, a feeder module, a transfer module and a clip attach module within a shared footprint. For example, an incoming clip source may be fed to the clip singulation module for clip singulation before the singulated clips are transferred by the feeder and transfer modules to a clip presentation area for clip alignment before pickup. A pickup tool of the clip attach module is configured to facilitate pickup and attachment of clips onto the semiconductor packages to be clip bonded. For example, the pickup head is programmable to facilitate clip bonding process of different applications which may require clips and packages with different sizes.

The present disclosure is directed to a high throughput clip bonding tool or system which is flexible and easily adapts to different clip bond pitches or sizes. The clip bonding system may be an integrated system with various modules, including a clip singulation module, a feeder module, a transfer module and a clip attach module within a shared footprint. For example, an incoming clip source may be fed to the clip singulation module for clip singulation before the singulated clips are transferred by the feeder and transfer modules to a clip presentation area for clip alignment before pickup. A pickup tool of the clip attach module is configured to facilitate pickup and attachment of clips onto the semiconductor packages to be clip bonded. For example, the pickup head is programmable to facilitate clip bonding process of different applications which may require clips and packages with different sizes.

A device which prints an electrically conductive pattern on a downhole tool using electrical ink includes a print head assembly and gripper claw assembly to print and manipulate the downhole tool during printing, respectively. The electrically conductive pattern may be an antenna coil, circuit or other desired pattern. After printing, the accuracy of the pattern is verified by the system and an impact resistant coating is applied to the pattern.

A device which prints an electrically conductive pattern on a downhole tool using electrical ink includes a print head assembly and gripper claw assembly to print and manipulate the downhole tool during printing, respectively. The electrically conductive pattern may be an antenna coil, circuit or other desired pattern. After printing, the accuracy of the pattern is verified by the system and an impact resistant coating is applied to the pattern.

A device which prints an electrically conductive pattern on a downhole tool using electrical ink includes a print head assembly and gripper claw assembly to print and manipulate the downhole tool during printing, respectively. The electrically conductive pattern may be an antenna coil, circuit or other desired pattern. After printing, the accuracy of the pattern is verified by the system and an impact resistant coating is applied to the pattern.

The present invention relates to an apparatus for bonding clips, a method of bonding clips, and a semiconductor package including semiconductor chips to which the clips are bonded using the method, and more particularly, to an apparatus for bonding clips, a method of bonding clips, and a semiconductor package including semiconductor chips to which the clips are bonded using the method, wherein the clips are sequentially bonded to the semiconductor chips by 1 unit so that a pitch difference between a lead frame array and a clip array is separately corrected to be the same and thereby, misalignment may be minimized so as to increase bonding accuracy of the clips to the semiconductor chips.

A device which prints an electrically conductive pattern on a downhole tool using electrical ink includes a print head assembly and gripper claw assembly to print and manipulate the downhole tool during printing, respectively. The electrically conductive pattern may be an antenna coil, circuit or other desired pattern. After printing, the accuracy of the pattern is verified by the system and an impact resistant coating is applied to the pattern.