In providing electrical wire-like connections between at least one semiconductor die arranged on a semiconductor die mounting area of a substrate and an array of electrically-conductive leads in the substrate, pressure force is applied to the electrically-conductive leads in the substrate during bonding the wire-like connections to the electrically-conductive leads. Such a pressure force is applied to the electrically-conductive leads in the substrate via a pair of mutually co-operating force transmitting surfaces. These surfaces include a first convex surface engaging a second concave surface.

A window clamp includes a center portion, side portions, and flexible members. The side portions are arranged on opposing sides of the center portion. The flexible members extend between the side portions and the center portion. The flexible members allow movement of the center portion in X, Y, and Z directions independent of movement of the side portions.

A manufacturing method for a wire bonding structure of the present invention includes a step of preparing a wire made of Cu and a step of joining the wire to a first joining target formed on an electronic device. Before the joining step, the wire has an outer circumferential surface and a withdrawn surface. The withdrawn surface is withdrawn toward a central axis of the wire from the outer circumferential surface. In the joining step, ultrasonic vibration is applied to the wire in a state in which the withdrawn surface is pressed against the first joining target.

In an SOP1 having a semiconductor chip and another semiconductor chip, in wire coupling between the chips, a withstand voltage can be secured by setting an inter-wire distance between a wire in a first wire group that is closest to a second wire group and a wire in the second wire group that is closest to the first wire group to be larger than an inter-wire distance between any wires in the first wire group and the second wire group, which makes it possible to attain improvement of reliability of the SOP1.

A window clamp includes a center portion, side portions, and flexible members. The side portions are arranged on opposing sides of the center portion. The flexible members extend between the side portions and the center portion. The flexible members allow movement of the center portion in X, Y, and Z directions independent of movement of the side portions.

In an SOP1 having a semiconductor chip and another semiconductor chip, in wire coupling between the chips, a withstand voltage can be secured by setting an inter-wire distance between a wire in a first wire group that is closest to a second wire group and a wire in the second wire group that is closest to the first wire group to be larger than an inter-wire distance between any wires in the first wire group and the second wire group, which makes it possible to attain improvement of reliability of the SOP1.

A manufacturing method for a wire bonding structure of the present invention includes a step of preparing a wire made of Cu and a step of joining the wire to a first joining target formed on an electronic device. Before the joining step, the wire has an outer circumferential surface and a withdrawn surface. The withdrawn surface is withdrawn toward a central axis of the wire from the outer circumferential surface. In the joining step, ultrasonic vibration is applied to the wire in a state in which the withdrawn surface is pressed against the first joining target.

A wire bonding array is provided. The wire bonding array includes a plurality of wire bonding systems, each of the plurality of wire bonding systems including a bond head assembly for bonding a wire to a workpiece and a support structure for supporting the workpiece. The wire bonding array also includes a wire bonding tool replacement system configured for installation on, and removal from, each of the plurality of wire bonding systems. The wire bonding array also includes a service robot configured to install the wire bonding tool replacement system on, and remove the wire bonding tool replacement system from, each of the plurality of wire bonding systems.