Patent classifications
H01L2224/79251
THERMOCOMPRESSION BONDING DEVICE
This thermocompression bonding device is provided with a heating tool (1) and a backup member (3). The backup member (3) has: a support portion (3a) which faces the tip (1a) of the heating tool (1) while first and second members (111, 122) to be joined and a cushioning member (2) are located therebetween, and which supports the first and second members (111, 122) to be joined; and a body portion (3b) provided on the opposite side of the support portion (3a) from the first and second members (111, 122) to be joined. The support portion (3a) is formed so that the heat conductivity thereof is lower than that of the body portion (3b).
Apparatus for the material-bonded connection of connection partners of a power-electronics component
A pressing ram having an elastic cushion element and intended for the material-bonded press-sintering connection of a first connection partner to a second connection partner of a power-electronics component. The elastic cushion element of the pressing ram is enclosed by a dimensionally stable frame, within which the cushion element and a guide part of the pressing ram are guided for linear movement such that the dimensionally stable frame lowers onto the first connection partner, or a workpiece carrier with the first connection partner arranged therein, and, following abutment against the same, the pressing ram together with the elastic cushion element is lowered onto the second connection partner and the elastic cushion exerts a pressure necessary for connecting the first connection partner to the second connection partner.
APPARATUS FOR THE MATERIAL-BONDED CONNECTION OF CONNECTION PARTNERS OF A POWER-ELECTRONICS COMPONENT
A pressing ram having an elastic cushion element and intended for the material-bonded press-sintering connection of a first connection partner to a second connection partner of a power-electronics component. The elastic cushion element of the pressing ram is enclosed by a dimensionally stable frame, within which the cushion element and a guide part of the pressing ram are guided for linear movement such that the dimensionally stable frame lowers onto the first connection partner, or a workpiece carrier with the first connection partner arranged therein, and, following abutment against the same, the pressing ram together with the elastic cushion element is lowered onto the second connection partner and the elastic cushion exerts a pressure necessary for connecting the first connection partner to the second connection partner.