A chip bonding apparatus and a securing assembly therefor are disclosed. The securing assembly includes a securing bracket, a sliding bracket, and a slide. A first open slot is arranged in the securing bracket, wherein the sliding bracket is slidably mounted on the first open slot, a snap-fitting portion is arranged on a side portion of the sliding bracket, and at least one catch slot that is engageable with the snap-fitting portion to secure the sliding bracket is arranged in the securing bracket. A second open slot is arranged in the sliding bracket, wherein a slideway is arranged in each of two side walls of the second open slot, and the slide is inserted into the slideway and hence mounted in the second open slot.