An electronic device includes a substrate, an electronic component, a first interposing layer and a second interposing layer. The substrate is non-planar and the substrate includes a first substrate pad and a second substrate pad. The electronic component includes a first component pad and a second component pad corresponding to the first substrate pad and the second substrate pad respectively. When the first component pad contacts the first substrate pad, a height difference exists between the second component pad and the second substrate pad. The first interposing layer connects between the first component pad and the first substrate pad. The second interposing layer connects between the second component pad and the second substrate pad. A thickness difference between the first interposing layer and the second interposing layer is 0.5 to 1 time the height difference.

A package comprising an integrated circuit substrate having an exposed substrate pad and having an exposed substrate dielectric, and an electronic component having an integrated circuit, having an exposed component pad and having an exposed component dielectric, wherein the integrated circuit substrate is connected with the electronic component so that there is a direct physical contact between the substrate pad and the component pad and so that there is a direct physical contact between the substrate dielectric and the component dielectric.

A package comprising an integrated circuit substrate having an exposed substrate pad and having an exposed substrate dielectric, and an electronic component having an integrated circuit, having an exposed component pad and having an exposed component dielectric, wherein the integrated circuit substrate is connected with the electronic component so that there is a direct physical contact between the substrate pad and the component pad and so that there is a direct physical contact between the substrate dielectric and the component dielectric.