Methods and apparatus to embed host dies in a substrate are disclosed An apparatus includes a first die having a first side and a second side opposite the first side. The first side includes a first contact to be electrically coupled with a second die. The second side includes a second contact. The apparatus further includes a substrate including a metal layer and a dielectric material on the metal layer. The first die is encapsulated within the dielectric material. The second contact of the first die is bonded to the metal layer independent of an adhesive.

A method of transferring a micro device is provided. The method includes: aligning a transfer plate with the micro device thereon with a receiving substrate having a contact pad thereon such that the micro device is above or in contact with the contact pad; moving a combination of the transfer plate with the micro device thereon and the receiving substrate into a confined space with a relative humidity greater than or equal to about 85% so as to condense some water between the micro device and the contact pad; and attaching the micro device to the contact pad.

A method of transferring a micro device is provided. The method includes: aligning a transfer plate with the micro device thereon with a receiving substrate having a contact pad thereon such that the micro device is above or in contact with the contact pad; moving a combination of the transfer plate with the micro device thereon and the receiving substrate into a confined space with a relative humidity greater than or equal to about 85% so as to condense some water between the micro device and the contact pad; and attaching the micro device to the contact pad.

A method for transferring a micro device is provided. The method includes: preparing a transfer plate with the micro device thereon in which the micro device is in contact with a picked-up surface of the transfer plate; forming a structure including the micro device, a contact pad of a receiving substrate, and some water therebetween in which two opposite surfaces of the water are respectively in contact with the micro device and a bound surface of the contact pad, and a hydrophilicity of the bound surface of the contact pad facing the transfer plate is greater than a hydrophilicity of the picked-up surface of the transfer plate facing the receiving substrate; and evaporating the water such that the micro device is bound to and in contact with the contact pad.

Exemplary embodiments for redistribution layers of integrated circuits are disclosed. The redistribution layers of integrated circuits of the present disclosure include one or more arrays of conductive contacts that are configured and arranged to allow a bonding wave to displace air between the redistribution layers during bonding. This configuration and arrangement of the one or more arrays minimize discontinuities, such as pockets of air to provide an example, between the redistribution layers during the bonding.

In an embodiment of the present invention, a method of forming a semiconductor device includes providing a semiconductor substrate including a first chip region and a second chip region. A first contact pad is formed over the first chip region and a second contact pad is formed over the second chip region. The first and the second contact pads are at least as thick as the semiconductor substrate. The method further includes dicing through the semiconductor substrate between the first and the second contact pads. The dicing is performed from a side of the semiconductor substrate including the first contact pad and the second contact pad. A conductive liner is formed over the first and the second contact pads and sidewalls of the semiconductor substrate exposed by the dicing.

In an embodiment of the present invention, a method of forming a semiconductor device includes providing a semiconductor substrate including a first chip region and a second chip region. A first contact pad is formed over the first chip region and a second contact pad is formed over the second chip region. The first and the second contact pads are at least as thick as the semiconductor substrate. The method further includes dicing through the semiconductor substrate between the first and the second contact pads. The dicing is performed from a side of the semiconductor substrate including the first contact pad and the second contact pad. A conductive liner is formed over the first and the second contact pads and sidewalls of the semiconductor substrate exposed by the dicing.

A light emitting device includes a carrier, at least one epitaxial structure, at least one buffer pad and at least one bonding pad. The epitaxial structure is disposed on the carrier. The buffer pad is disposed between the carrier and the epitaxial structure, wherein the epitaxial structure is temporarily bonded to the carrier by the buffer pad. The bonding pad is disposed on the epitaxial structure, wherein the epitaxial structure is electrically connected to a receiving substrate by the bonding pad.