H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/80
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L2224/80
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L2224/80001
by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
H01L2224/80001
by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
H01L2224/80894
Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces
H01L2224/80894
Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces
H01L2224/80895
between electrically conductive surfaces, e.g. copper-copper direct bonding, surface activated bonding
H01L2224/80895
between electrically conductive surfaces, e.g. copper-copper direct bonding, surface activated bonding