A device includes a porous substrate that include a plurality of pores and a plurality of nanodevices dispersed in at least a portion of the plurality of pores. Each of the plurality of nanodevices includes a magnetic nanowire and a solder nanoparticle. The magnetic nanowires are configured to generate heat in response to an alternating magnetic field. The solder nanoparticles are configured to receive a portion of the heat and reflow to connect to one or more devices or surfaces.

The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages.

A bonding method of package components and a bonding apparatus are provided. The method includes: providing at least one first package component and a second package component, wherein the at least one first package component has first electrical connectors and a first dielectric layer at a bonding surface of the at least one first package component, and the second package component has second electrical connectors and a second dielectric layer at a bonding surface of the second package component; bringing the at least one first package component and the second package component in contact, such that the first electrical connectors approximate or contact the second electrical connectors; and selectively heating the first electrical connectors and the second electrical connectors by electromagnetic induction, in order to bond the first electrical connectors with the second electrical connectors.

Magnetic structures may be incorporated into integrated circuit assemblies, which will enable local heating and reflow of solder interconnects for the attachment of integrated circuit devices to electronic substrates. Such magnetic structures will eliminate exposure of the entire integrated circuit assembly to elevated temperatures for an extended period of time, which eliminates associated warpage and thermal degradation consequences from such exposure. Additionally, such magnetic structures will allow for re-workability of specific solder interconnects.

A semiconductor assembly packaging method, a semiconductor assembly and an electronic device are provided. The method comprises providing an interconnect board and at least one semiconductor device; aligning and attaching the at least one semiconductor device to the interconnect board by forming a plurality of alignment solder joints; applying pressure to the at least one semiconductor device and/or the interconnect board while the alignment solder joints are in a molten or partially molten state, whereby first connection terminals on the interconnect board are joined with and bonded to corresponding second connection terminals on the at least one semiconductor device. Using the packaging method, the semiconductor device and the interconnect board can be aligned accurately using relatively simple and low cost processes and equipment. The method can also be used to align and bond at least one semiconductor device to another semiconductor device.

A semiconductor assembly packaging method, a semiconductor assembly and an electronic device are provided. The method comprises providing an interconnect board and at least one semiconductor device; aligning and attaching the at least one semiconductor device to the interconnect board by forming a plurality of alignment solder joints; applying pressure to the at least one semiconductor device and/or the interconnect board while the alignment solder joints are in a molten or partially molten state, whereby first connection terminals on the interconnect board are joined with and bonded to corresponding second connection terminals on the at least one semiconductor device. Using the packaging method, the semiconductor device and the interconnect board can be aligned accurately using relatively simple and low cost processes and equipment. The method can also be used to align and bond at least one semiconductor device to another semiconductor device.

A bonding method of package components and a bonding apparatus are provided. The method includes: providing at least one first package component and a second package component, wherein the at least one first package component has first electrical connectors and a first dielectric layer at a bonding surface of the at least one first package component, and the second package component has second electrical connectors and a second dielectric layer at a bonding surface of the second package component; bringing the at least one first package component and the second package component in contact, such that the first electrical connectors approximate or contact the second electrical connectors; and selectively heating the first electrical connectors and the second electrical connectors by electromagnetic induction, in order to bond the first electrical connectors with the second electrical connectors.

A bonding method of package components and a bonding apparatus are provided. The method includes: providing at least one first package component and a second package component, wherein the at least one first package component has first electrical connectors and a first dielectric layer at a bonding surface of the at least one first package component, and the second package component has second electrical connectors and a second dielectric layer at a bonding surface of the second package component; bringing the at least one first package component and the second package component in contact, such that the first electrical connectors approximate or contact the second electrical connectors; and selectively heating the first electrical connectors and the second electrical connectors by electromagnetic induction, in order to bond the first electrical connectors with the second electrical connectors.

A bonding method of package components and a bonding apparatus are provided. The method includes: providing at least one first package component and a second package component, wherein the at least one first package component has first electrical connectors and a first dielectric layer at a bonding surface of the at least one first package component, and the second package component has second electrical connectors and a second dielectric layer at a bonding surface of the second package component; bringing the at least one first package component and the second package component in contact, such that the first electrical connectors approximate or contact the second electrical connectors; and selectively heating the first electrical connectors and the second electrical connectors by electromagnetic induction, in order to bond the first electrical connectors with the second electrical connectors.

Magnetic structures incorporated into integrated circuit assemblies. In some examples, the magnetic structures may enable local heating and reflow of solder interconnects for the attachment of integrated circuit devices to electronic substrates.