Embodiments include a reflowable grid array (RGA) interposer, a semiconductor packaged system, and a method of forming the semiconductor packaged system. The RGA interposer includes a substrate having vias and zones, where the zones have embedded heaters. The heaters may include first traces, second traces, and via filament interconnects. The vias may have a z-height greater than a z-height of the heaters, and each of the zones may have a grid pattern. The RGA interposer may include first and second layers in the substrate, where the first layer includes the first traces, the second layer includes the second traces, and the second layer is over the first layer. The grid pattern may have parallel first traces orthogonal to parallel second traces to form a pattern of squares, where the pattern of squares has the first traces intersect the second traces substantially at right angles.

Embodiments include a reflowable grid array (RGA) interposer, a semiconductor packaged system, and a method of forming the semiconductor packaged system. The RGA interposer includes a plurality of heater traces in a substrate. The RGA interposer also includes a plurality of vias in the substrate. The vias extend vertically from the bottom surface to the top surface of the substrate. The RGA interposer may have one of the vias between two of the heater traces, wherein the vias have a z-height that is greater than a z-height of the heater traces. The heater traces may be embedded in a layer of the substrate, where the layer of the substrate is between top ends and bottom ends of the vias. Each of the plurality of heater traces may include a via filament interconnect coupled to a power source and a ground source. The heater traces may be resistive heaters.

A chip mounting structure and a chip mounting device are provided. The chip mounting structure includes a circuit substrate and a plurality of micro heaters. The circuit substrate has a plurality of solder pads. A plurality of micro heaters are disposed on the circuit substrate adjacent to the solder pad. The plurality of chips are disposed on the circuit substrate, and the chip is electrically connected to the solder pad by a solder ball. Therefore, the soldering yield of the process can be reduced by the chip mounting structure and the chip mounting device.

A chip mounting structure and a chip mounting device are provided. The chip mounting structure includes a circuit substrate and a plurality of micro heaters. The circuit substrate has a plurality of solder pads. A plurality of micro heaters are disposed on the circuit substrate adjacent to the solder pad. The plurality of chips are disposed on the circuit substrate, and the chip is electrically connected to the solder pad by a solder ball. Therefore, the soldering yield of the process can be reduced by the chip mounting structure and the chip mounting device.

A film structure, a chip carrier assembly, and a chip carrier device are provided. The film structure includes a film and a plurality of micro-heaters. In which, the film is applied on a substrate, and the plurality of micro-heaters is disposed on top of the film or in the film. The chip carrier assembly includes a circuit substrate and the film structure. In which, the circuit substrate carries a plurality of chips. The chip carrier device includes the chip carrier assembly and a suction unit. In which, the suction unit is arranged above the chip carrier assembly to attach on and transfer the plurality of chips to the circuit substrate. The chips are disposed on the circuit substrate through solder balls, and the micro-heaters heat the solder balls that are in contact with the chips.

A film structure, a chip carrier assembly, and a chip carrier device are provided. The film structure includes a film and a plurality of micro-heaters. In which, the film is applied on a substrate, and the plurality of micro-heaters is disposed on top of the film or in the film. The chip carrier assembly includes a circuit substrate and the film structure. In which, the circuit substrate carries a plurality of chips. The chip carrier device includes the chip carrier assembly and a suction unit. In which, the suction unit is arranged above the chip carrier assembly to attach on and transfer the plurality of chips to the circuit substrate. The chips are disposed on the circuit substrate through solder balls, and the micro-heaters heat the solder balls that are in contact with the chips.

Embodiments herein relate to systems, apparatuses, or processes for coupling or decoupling two substrates by heating pins on one of the substrates and either inserting or withdrawing the heated pins from solder elements on a BGA. In particular, by heating a plurality of pins on a first side of a first substrate, where the plurality of pins are substantially perpendicular to a plane of the substrate, inserting the heated plurality of pins into BGA attached to a second substrate where the BGA includes a plurality of solder elements aligned with the plurality of pins and where the heated plurality of pins melt the plurality of solder elements upon insertion. The inserted plurality of pins physically and/or electrically couple the first substrate and the second substrate.

A chip-transferring system and a chip-transferring method are provided. The chip-transferring method includes: providing a chip carrying structure carrying an electronic chip; providing a circuit substrate, wherein a soldering material is configured between the electronic chip and the circuit substrate; providing a pin structure, wherein the electronic chip is transferred from the chip carrying structure to the circuit substrate through thrust of the pin structure; approaching a conductive coil structure of an eddy current generating module toward the soldering material , so that the soldering material is heated and cured indirectly through an eddy current generated by the conductive coil structure.

A chip-carrying structure and a chip-bonding method are provided. The chip-carrying structure includes a circuit substrate for carrying a plurality of conductive materials, a plurality of micro heaters disposed on or inside the circuit substrate, and a micro heater control chip electrically connected to the micro heaters. Therefore, when a chip is disposed on two corresponding ones of the conductive materials, the micro heater control chip is configured to control a corresponding one of the micro heaters to start or stop heating the two corresponding conductive materials according to chip movement information of the chip.

A semiconductor manufacturing system comprises a laser and a heated bond tip and is configured to bond a die stack in a semiconductor assembly. The semiconductor assembly includes a wafer, manufacture from a material that is optically transparent to a beam emitted by the laser and configured to support a die stack comprising a plurality of semiconductor dies. A metal film is deposited on the wafer and heatable by the beam emitted by the laser. The heated bond tip applies heat and pressure to the die stack, compressing the die stack between the heated bond tip and the metal film and thermally bonding dies in the stack by heat emitted by the heated bond tip and the metal film when the metal film is heated by the beam emitted from the laser.