Methods/structures of joining package structures are described. Those methods/structures may include forming a metal formate on a surface of a first solder interconnect structure disposed on a first package substrate at a first temperature, and attaching a second solder interconnect structure disposed on a second package substrate to the first solder interconnect structure at a second temperature. The second temperature decomposes at least a portion of the metal formate and generates a hydrogen gas. The generated hydrogen gas removes an oxide from the second solder interconnect structure during joint formation at the second temperature.

A bonding method is provided. A sheet structure is placed on a substrate surface, and a surface roughness of a surface of the sheet structure is less than or equal to 1.0 micrometer. A carbon nanotube structure is laid on the surface of the sheet structure. Two ends of the carbon nanotube structure are in direct contact with the substrate surface. An organic solvent is added to the two ends of the carbon nanotube structure. An object is laid on the carbon nanotube structure, and a surface of the object being in direct contact with the carbon nanotube structure has a surface roughness less than or equal to 1.0 micrometer.

A bonding method is provided. A sheet structure is placed on a substrate surface, and a surface roughness of a surface of the sheet structure is less than or equal to 1.0 micrometer. A carbon nanotube structure is laid on the surface of the sheet structure. Two ends of the carbon nanotube structure are in direct contact with the substrate surface. An organic solvent is added to the two ends of the carbon nanotube structure. An object is laid on the carbon nanotube structure, and a surface of the object being in direct contact with the carbon nanotube structure has a surface roughness less than or equal to 1.0 micrometer.

A bonding method is provided. A sheet structure is placed on a substrate surface, and a surface roughness of a surface of the sheet structure is less than or equal to 1.0 micrometer. A carbon nanotube structure is laid on the surface of the sheet structure. Two ends of the carbon nanotube structure are in direct contact with the substrate surface. An organic solvent is added to the two ends of the carbon nanotube structure. An object is laid on the carbon nanotube structure, and a surface of the object being in direct contact with the carbon nanotube structure has a surface roughness less than or equal to 1.0 micrometer.

A bonding method is provided. A sheet structure is placed on a substrate surface, and a surface roughness of a surface of the sheet structure is less than or equal to 1.0 micrometer. A carbon nanotube structure is laid on the surface of the sheet structure. Two ends of the carbon nanotube structure are in direct contact with the substrate surface. An organic solvent is added to the two ends of the carbon nanotube structure. An object is laid on the carbon nanotube structure, and a surface of the object being in direct contact with the carbon nanotube structure has a surface roughness less than or equal to 1.0 micrometer.

Methods/structures of joining package structures are described. Those methods/structures may include forming a metal formate on a surface of a first solder interconnect structure disposed on a first package substrate at a first temperature, and attaching a second solder interconnect structure disposed on a second package substrate to the first solder interconnect structure at a second temperature. The second temperature decomposes at least a portion of the metal formate and generates a hydrogen gas. The generated hydrogen gas removes an oxide from the second solder interconnect structure during joint formation at the second temperature.

A method of making an electronic device having a discrete device mounted on a surface of an electronic die with both the discrete device and the die connected by heat cured conductive ink and covered with cured encapsulant including placing the discrete device on the die; and keeping the temperature of each of the discrete device and the die below about 200 C. Also disclosed is a method of electrically attaching a discrete device to a substrate that includes placing the device on the substrate, applying conductive ink that connects at least one terminal on the device to at least one contact on the substrate and curing the conductive ink. Also disclosed is an IC package with a discrete electrical device having electrical terminals; an electrical substrate having contact pads on a surface thereof; and cured conductive ink connecting at least one of the electrical terminals with at least one of the contact pads.

A method of making an electronic device having a discrete device mounted on a surface of an electronic die with both the discrete device and the die connected by heat cured conductive ink and covered with cured encapsulant including placing the discrete device on the die; and keeping the temperature of each of the discrete device and the die below about 200 C. Also disclosed is a method of electrically attaching a discrete device to a substrate that includes placing the device on the substrate, applying conductive ink that connects at least one terminal on the device to at least one contact on the substrate and curing the conductive ink. Also disclosed is an IC package with a discrete electrical device having electrical terminals; an electrical substrate having contact pads on a surface thereof; and cured conductive ink connecting at least one of the electrical terminals with at least one of the contact pads.