A display device may include a display area including pixel areas each including an emission area, a non-display area, and a pixel disposed in each of the pixel areas. The pixel may include a first electrode, a second electrode spaced apart from the first electrode and surrounding a periphery of the first electrode, a third electrode spaced apart from the second electrode and surrounding a periphery of the second electrode, a fourth electrode spaced apart from the third electrode and surrounding a periphery of the third electrode, light emitting elements disposed between the first to fourth electrodes, and first and second conductive lines disposed under the first to fourth electrodes with an insulating layer disposed therebetween. The first conductive line may be electrically connected to the first electrode, and the second conductive line may be electrically connected to the fourth electrode.

A pixel includes first and second sub-pixel areas adjacent to each other in a first direction; first and second electrodes disposed in each of the first and the second sub-pixel areas, and spaced apart from each other; light emitting elements disposed between the first and the second electrodes in each of the first and the second sub-pixel areas; a first driving transistor disposed in the first sub-pixel area, and electrically connected to the first electrode; and a second driving transistor disposed in the second sub-pixel area, and electrically connected to the first electrode. The first electrode of the first sub-pixel area and the first electrode of the second sub-pixel area are electrically disconnected from each other, and the second electrode of the first sub-pixel area and the second electrode of the second sub-pixel area are electrically connected to each other.

A display device may include a display area including pixel areas each including an emission area, a non-display area, and a pixel disposed in each of the pixel areas. The pixel may include a first electrode, a second electrode spaced apart from the first electrode and surrounding a periphery of the first electrode, a third electrode spaced apart from the second electrode and surrounding a periphery of the second electrode, a fourth electrode spaced apart from the third electrode and surrounding a periphery of the third electrode, light emitting elements disposed between the first to fourth electrodes, and first and second conductive lines disposed under the first to fourth electrodes with an insulating layer disposed therebetween. The first conductive line may be electrically connected to the first electrode, and the second conductive line may be electrically connected to the fourth electrode.

An embodiment for manufacturing electronic devices is proposed. The embodiment includes the following phases: a) forming a plurality of chips in a semiconductor material wafer including a main surface; each chip includes respective integrated electronic components and respective contact pads facing the main surface; said contact pads are electrically coupled to the integrated electronic components; b) attaching at least one conductive ribbon to at least one contact pad of each chip; c) covering the main surface of the semiconductor material wafer and the at least one conductive ribbon with a layer of plastic material; d) lapping an exposed surface of the layer of plastic material to remove a portion of the plastic material layer at least to uncover portions of the at least one conductive ribbon, and e) sectioning the semiconductor material wafer to separate the chips.