One or more chips are transferred from one substrate to another by using one or more polymer layers to secure the one or more chips to an intermediate carrier substrate. While secured to the intermediate carrier substrate, the one or more chips may be transported or put through further processing or fabrication steps. To release the one or more chips, the adhesion strength of the one or more polymer layers is gradually reduced to minimize potential damage to the one or more chips.

Methods of making a printed structure include providing a target substrate, coating the target substrate with an uncured adhesive, disposing a component on the uncured adhesive, processing the uncured adhesive with or without a pattern, and curing the uncured adhesive. Some embodiments include having a target-substrate contact pad on the target substrate, disposing a post component on the uncured adhesive over the target-substrate contact pad, the post component having an electrical connection extending from the post component toward the target-substrate contact pad, disposing a non-post component on the uncured adhesive laterally displaced from the post component, pattern-wise processing the uncured adhesive so that a first portion of the uncured adhesive adjacent to the post component is not processed and a second portion of the uncured adhesive adjacent to the non-post component is processed, reflowing the unprocessed first portion of the uncured adhesive, and curing the uncured adhesive.

Semiconductor device assemblies that comprise a package substrate having semiconductor devices on two sides. A solder layer can thermally couple one or more semiconductor devices on a side of the package with a circuit board. Methods of manufacturing assemblies having a semiconductor device thermally coupled to a circuit board are also provided.