Patent classifications
H
H01
H01L
2224/00
H01L2224/80
H01L2224/84
H01L2224/84053
H01L2224/84095
H01L2224/84096
H01L2224/84097
H01L2224/84097
CLIP
There is disclosed a clip for a semi-conductor device. At least part of the clip is formed from a metallic foam.