A semiconductor die and an electrically conductive ribbon are arranged on a substrate. The electrically conductive ribbon includes a roughened surface. An insulating encapsulation is molded onto the semiconductor die and the electrically conductive ribbon. The roughened surface of the electrically conductive ribbon provides a roughened coupling interface to the insulating encapsulation.

A method of manufacturing a semiconductor device is provided. The method includes securing a die to a die paddle with solder and securing a clip to the die with solder to form a first subassembly. The method further includes heating the first subassembly to at least the melting temperature of the solder, then subsequently removing at least some of the solder from the die paddle in a region adjacent the die to expose the die paddle in that region. The method further includes moulding a casing on to the first subassembly so that the casing at least partly surrounds the die, the die paddle, and the clip.