This wire bonding apparatus has a capillary, a movement mechanism moving the capillary, and a control unit controlling driving of the movement mechanism. The control unit at least causes execution of: a first process (trajectory a) of lowering the capillary, after a FAB is formed, to pressure bonding height at a first bonding point to form a pressure bonded ball and a column part at the first bonding point; a second process (trajectory b) of moving the capillary horizontally at the pressure bonding height after execution of the first process to scarp off the column part by the capillary; and a third process (trajectory c-k) of repeating a pressing operation at least once after execution of the second process, the pressing operation involving moving the capillary forward and lowering the capillary temporarily during movement so that the capillary presses down on a wire portion positioned over the pressure bonded ball.

Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises semiconductor chips stacked on a substrate and including first and second pads on top surfaces thereof, and bonding wires connecting the first and second pads to the substrate. The semiconductor chips alternately protrude in a first direction and its opposite direction. The semiconductor chip has a first lateral surface spaced apart from another semiconductor chip. The top surface of the semiconductor chip is provided thereon with a first arrangement line extending along the first lateral surface and with second arrangement lines extending from opposite ends of the first arrangement line. Wherein as a distance between the first and second arrangement lines increases, a distance between the second arrangement lines and the first lateral surface increases. The first pads are arranged along the first arrangement line. The second pads are arranged along the second arrangement lines.

The present invention includes a bonding process of bonding a wire to an electrode by a capillary, a wire feeding process of raising the capillary to feed the wire from a tip, a pressing process of moving the capillary to press an inner edge of the capillary against the wire, a scraping process of vibrating the tip of the capillary to form a scrape on a side surface of the wire by the inner edge of the capillary, and a cut-off process of closing a wire clamper and cutting off the wire at a portion of the scrape to form a pin wire extending vertically upward from the electrode.

Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises semiconductor chips stacked on a substrate and including first and second pads on top surfaces thereof, and bonding wires connecting the first and second pads to the substrate. The semiconductor chips alternately protrude in a first direction and its opposite direction. The semiconductor chip has a first lateral surface spaced apart from another semiconductor chip. The top surface of the semiconductor chip is provided thereon with a first arrangement line extending along the first lateral surface and with second arrangement lines extending from opposite ends of the first arrangement line. Wherein as a distance between the first and second arrangement lines increases, a distance between the second arrangement lines and the first lateral surface increases. The first pads are arranged along the first arrangement line. The second pads are arranged along the second arrangement lines.

This wire bonding apparatus has a capillary, a movement mechanism moving the capillary, and a control unit controlling driving of the movement mechanism. The control unit at least causes execution of: a first process (trajectory a) of lowering the capillary, after a FAB is formed, to pressure bonding height at a first bonding point to form a pressure bonded ball and a column part at the first bonding point; a second process (trajectory b) of moving the capillary horizontally at the pressure bonding height after execution of the first process to scarp off the column part by the capillary; and a third process (trajectory c-k) of repeating a pressing operation at least once after execution of the second process, the pressing operation involving moving the capillary forward and lowering the capillary temporarily during movement so that the capillary presses down on a wire portion positioned over the pressure bonded ball.

Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises semiconductor chips stacked on a substrate and including first and second pads on top surfaces thereof, and bonding wires connecting the first and second pads to the substrate. The semiconductor chips alternately protrude in a first direction and its opposite direction. The semiconductor chip has a first lateral surface spaced apart from another semiconductor chip. The top surface of the semiconductor chip is provided thereon with a first arrangement line extending along the first lateral surface and with second arrangement lines extending from opposite ends of the first arrangement line. Wherein as a distance between the first and second arrangement lines increases, a distance between the second arrangement lines and the first lateral surface increases. The first pads are arranged along the first arrangement line. The second pads are arranged along the second arrangement lines.