An adhesive film for semiconductors, the adhesive film containing a thermosetting component. The adhesive film exhibits a shear viscosity at a frequency of 4.4 Hz of 2000 Pa.Math.s or more at the minimum and 200000 Pa.Math.s at the maximum in a range of 60 to 150 C. The adhesive film may be used for bonding to a substrate while embedding another semiconductor chip. The adhesive film may be used to bond a semiconductor chip to another semiconductor chip while embedding part or the whole of a wire connected to the other semiconductor chip.