Patent classifications
H
ELECTRICITY
Load children
H01
ELECTRIC ELEMENTS
Load children
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
Load children
2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/80
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/85121
Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/85122
by detecting inherent features of, or outside, the semiconductor or solid-state body
Load children Filter patents View analytics View as hierarchy Open in page

H01L2224/85122

Wire bond clamp design and lead frame capable of engaging with same
10861777 · 2020-12-08 · ·

Aspects of the disclosure relate generally to semiconductor packaging, and specifically to semiconductor device having a lead frame having a semiconductor supporting die pad that is capable of engaging with a wire bonding clamp.

WIRE BOND CLAMP DESIGN AND LEAD FRAME CAPABLE OF ENGAGING WITH SAME
20190206769 · 2019-07-04 ·

Aspects of the disclosure relate generally to semiconductor packaging, and specifically to semiconductor device having a lead frame having a semiconductor supporting die pad that is capable of engaging with a wire bonding clamp.