A method for joining a microelectronic chip to at least one wire element comprises a first step of applying a cover to a first face of the microelectronic chip, the cover being configured to form, with the first face, at least one temporary side groove. The method additionally comprises a step of inserting the wire element into the temporary groove. The method further comprises a step of attaching the wire element to the microelectronic chip. The method additionally comprises a step of removing the cover from the microelectronic chip.

Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

A method for joining a microelectronic chip to at least one wire element comprises: a first step of applying a cover to a first face of the microelectronic chip, the cover being configured to form, with the first face, at least one temporary side groove; a step of inserting the wire element into the temporary groove; a step of attaching the wire element to the microelectronic chip; and a step of removing the cover from the microelectronic chip.

Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

Provided is a semiconductor package including a chip stack that includes first and second semiconductor chips stacked in a first direction and offset in a second direction intersecting the first direction, each of the first and second semiconductor chips comprising chip pads in the second direction, a redistribution substrate on the chip stack, first bonding wires connecting the redistribution substrate and the chip pads of the first semiconductor chip, and first vertical wires connecting the redistribution substrate and the chip pads of the second semiconductor chip. Each of the first bonding wires includes a first portion in contact with one of the chip pads of the first semiconductor chip and having a first width, and a second portion extending perpendicularly on the first portion and having a second width, each of the first vertical wires has a third width, and each of the second and third widths is smaller than the first width.