The present disclosure is drawn to, among other things, a method of forming a semiconductor shield from a stock material having a thickness. In some aspects the methods includes providing a first layer of material on a first surface of the stock material, wherein at least a portion of the first layer of material includes a first window that exposes a portion of the first surface; providing a second layer of material on a second surface of the stock material, wherein the second surface of the stock material is spaced from the first surface by the thickness of the stock material, and wherein at least portion of the second layer of material includes a second window that exposes a portion of the second surface; and selectively removing a portion of the stock material exposed at the first or second windows, wherein the portion removed includes less than an entirety of the thickness of the stock material.

The present disclosure is drawn to, among other things, a method of forming a semiconductor shield from a stock material having a thickness. In some aspects the methods includes providing a first layer of material on a first surface of the stock material, wherein at least a portion of the first layer of material includes a first window that exposes a portion of the first surface; providing a second layer of material on a second surface of the stock material, wherein the second surface of the stock material is spaced from the first surface by the thickness of the stock material, and wherein at least portion of the second layer of material includes a second window that exposes a portion of the second surface; and selectively removing a portion of the stock material exposed at the first or second windows, wherein the portion removed includes less than an entirety of the thickness of the stock material.

The present disclosure is drawn to, among other things, a method of forming a semiconductor shield from a stock material having a thickness. In some aspects the methods includes providing a first layer of material on a first surface of the stock material, wherein at least a portion of the first layer of material includes a first window that exposes a portion of the first surface; providing a second layer of material on a second surface of the stock material, wherein the second surface of the stock material is spaced from the first surface by the thickness of the stock material, and wherein at least portion of the second layer of material includes a second window that exposes a portion of the second surface; and selectively removing a portion of the stock material exposed at the first or second windows, wherein the portion removed includes less than an entirety of the thickness of the stock material.

The present disclosure is drawn to, among other things, a method of forming a semiconductor shield from a stock material having a thickness. In some aspects the methods includes providing a first layer of material on a first surface of the stock material, wherein at least a portion of the first layer of material includes a first window that exposes a portion of the first surface; providing a second layer of material on a second surface of the stock material, wherein the second surface of the stock material is spaced from the first surface by the thickness of the stock material, and wherein at least portion of the second layer of material includes a second window that exposes a portion of the second surface; and selectively removing a portion of the stock material exposed at the first or second windows, wherein the portion removed includes less than an entirety of the thickness of the stock material.

A semiconductor apparatus includes a semiconductor device, a lower wire member, and an upper wire member. The semiconductor device includes a semiconductor device body having a main surface, and a metal layer. The lower wire member includes an end surface and an end surface. In a plan view of the main surface, the end surface and the end surface are located inside a periphery of the semiconductor device. The upper wire member is stacked on the lower wire member. In the plan view of the main surface, a portion of the upper wire member is located outside the periphery of the semiconductor device. The upper wire member is joined to the metal layer with the lower wire member being interposed therebetween.