A chip-on film and a display device including the same are disclosed. The chip-on film includes a first base film, a second base film positioned on the first base film, a film pad portion positioned on at least one side of the second base film and exposed to the outside of the first base film, and a coating layer positioned on one surface of the first base film.

An apparatus is provided which comprises: a first die having at least one bond pad; a first flexible layer comprising an anisotropic conductive material, wherein the first flexible layer is adjacent to the at least one bond pad such that it makes an electrical contact with the at least one bond pad; and a second flexible layer comprising a conductive metal, wherein the second flexible layer is adjacent to the first flexible layer.

An adhesive substrate includes a support base member and an adhesive layer provided on the support base member. The support base member contains electroconductive particles and an insulating resin, and has a recessed and projected pattern with two or more projected portions on one surface or both surfaces of the support base member. The adhesive layer is provided at least on upper surfaces of the projected portions in the recessed and projected pattern of the support base member. The adhesive layer on the upper surfaces of the projected portions has an upper surface with a curved surface. Thus, the present invention provides an adhesive substrate capable of selectively picking up and quickly transferring large amounts of fine chips and particles, a method for producing the adhesive substrate, and a transfer device.

An adhesive substrate includes a support base member and an adhesive layer provided on the support base member. The support base member contains electroconductive particles and an insulating resin, and has a recessed and projected pattern with two or more projected portions on one surface or both surfaces of the support base member. The adhesive layer is provided at least on upper surfaces of the projected portions in the recessed and projected pattern of the support base member. The adhesive layer on the upper surfaces of the projected portions has an upper surface with a curved surface. Thus, the present invention provides an adhesive substrate capable of selectively picking up and quickly transferring large amounts of fine chips and particles, a method for producing the adhesive substrate, and a transfer device.

An apparatus is provided which comprises: a first die having at least one bond pad; a first flexible layer comprising an anisotropic conductive material, wherein the first flexible layer is adjacent to the at least one bond pad such that it makes an electrical contact with the at least one bond pad; and a second flexible layer comprising a conductive metal, wherein the second flexible layer is adjacent to the first flexible layer.

A chip-on film and a display device including the same are disclosed. The chip-on film includes a first base film, a second base film positioned on the first base film, a film pad portion positioned on at least one side of the second base film and exposed to the outside of the first base film, and a coating layer positioned on one surface of the first base film.