Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/91
Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
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H01L2224/92
Specific sequence of method steps
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H01L2224/921
Connecting a surface with connectors of different types
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H01L2224/9212
Sequential connecting processes
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H01L2224/92132
the first connecting process involving a build-up interconnect
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H01L2224/92132

Semiconductor package with embedded die and its methods of fabrication
09780054 · 2017-10-03 · ·

Embodiments of the present invention describe a semiconductor package having an embedded die. The semiconductor package comprises a coreless substrate that contains the embedded die. The semiconductor package provides die stacking or package stacking capabilities. Furthermore, embodiments of the present invention describe a method of fabricating the semiconductor package that minimizes assembly costs.