A method of forming a semiconductor package is provided. The method includes forming a metallization stack over a semiconductor die. Polymer particles are mounted over the metallization stack. Each of the polymer particles is coated with a first bonding layer. A heat spreader lid is bonded with the semiconductor die by reflowing the first bonding layer. A composite thermal interface material (TIM) structure is formed between the heat spreader lid and the semiconductor die during the bonding. The composite TIM structure includes the first bonding layer and the polymer particles embedded in the first bonding layer.

A method of forming a semiconductor package is provided. The method includes forming a metallization stack over a semiconductor die. Polymer particles are mounted over the metallization stack. Each of the polymer particles is coated with a first bonding layer. A heat spreader lid is bonded with the semiconductor die by reflowing the first bonding layer. A composite thermal interface material (TIM) structure is formed between the heat spreader lid and the semiconductor die during the bonding. The composite TIM structure includes the first bonding layer and the polymer particles embedded in the first bonding layer.

An image pickup apparatus includes an image pickup device including a wiring connecting a first electrode on a light receiving surface and a second electrode on a rear surface, a first wiring board including a distal end surface, from which a flying lead protrudes, arranged to oppose the rear surface of the image pickup device, a second wiring board including a second main surface to which an upper surface of the first wiring board is made to adhere and including a distal end surface arranged to oppose the rear surface, in which the flying lead is bent and bonded to the second electrode, and a sealing member sealing a bonding section between the second electrode and the flying lead and an adhesion member that makes the distal end surface of the second wiring board and the rear surface adhere to each other are composed of integral curable resin.

A semiconductor package is provided. The semiconductor package includes a substrate and a semiconductor die over the substrate. A heat-dissipating feature covers the substrate and the semiconductor die, and a composite thermal interface material (TIM) structure is thermally bonded between the semiconductor die and the heat-dissipating feature. The composite TIM structure includes a metal-containing matrix material layer and polymer particles embedded in the metal-containing matrix material layer.

A semiconductor package is provided. The semiconductor package includes a substrate and a semiconductor die over the substrate. A heat-dissipating feature covers the substrate and the semiconductor die, and a composite thermal interface material (TIM) structure is thermally bonded between the semiconductor die and the heat-dissipating feature. The composite TIM structure includes a metal-containing matrix material layer and polymer particles embedded in the metal-containing matrix material layer.

An image pickup apparatus includes an image pickup device including a wiring that connects a first electrode on a light receiving surface and a second electrode on a rear surface, a first wiring board including a distal end surface, from which a flying lead protrudes, arranged to oppose the rear surface of the image pickup device, and a second wiring board including a second main surface to which an upper surface of the first wiring board is made to adhere and including a distal end surface arranged to oppose the rear surface, in which the flying lead is bent and is bonded to the second electrode, and a sealing member that seals a bonding section between the second electrode and the flying lead and an adhesion member that makes the distal end surface of the second wiring board and the rear surface adhere to each other are composed of integral curable resin.