A light-emitting element ink and a method of manufacturing a display device using the light-emitting element ink are provided. The light-emitting element ink comprises a solvent, a dispersant mixed with the solvent, and a plurality of light-emitting elements dispersed in the solvent, each of the light-emitting elements including a plurality of semiconductor layers and an insulating film surrounding parts of outer surfaces of the semiconductor layers, wherein the dispersant includes an aqueous dispersant or an organic dispersant, if the dispersant is the aqueous dispersant, the solvent has a hydrogen bonding parameter, of Hansen's solubility parameters, of less than 7, and if the dispersant is the organic dispersant, the solvent has a hydrogen bonding parameter, of Hansen's solubility parameters, of 7 or greater.

A display device may include: a substrate including a display area and a non-display area; and pixels disposed on the display area, and each including sub-pixels, each sub-pixel including a pixel circuit layer, and a display element layer including a light emitting element. The display element layer includes first and second electrodes spaced apart from each other; a first insulating layer disposed between the pixel circuit layer and the light emitting element; and a second insulating layer disposed on the light emitting element and filling spaces between the first insulating layer and ends of the light emitting element. The light emitting element includes a first conductive semiconductor layer, an active layer enclosing at least one side of the first conductive semiconductor layer, a second conductive semiconductor layer enclosing the active layer, an electrode layer enclosing the second conductive semiconductor layer, and an insulating film covering the electrode layer.

A dipole alignment device includes an electric field forming part including a stage, and a probe part which form an electric field on the stage; an inkjet printing apparatus including at least one inkjet head which sprays ink including dipoles and a solvent with the dipoles dispersed therein onto the stage; a transportation part comprising a first moving part which moves the electric field forming part in at least one direction; and a light irradiation apparatus including a light irradiation part which applies light to the ink sprayed onto the stage.

An ink leveling device includes a stage on which a target substrate is disposed, base frames disposed at sides of the stage, moving members coupled to the base frames and movable upward and downward, and at least one plate coupled to the moving members and disposed to press the target substrate. Light-emitting element ink is disposed on the target substrate.

A display device includes a first electrode disposed on a substrate, a second electrode disposed on the substrate, and spaced apart from and facing the first electrode, at least one light emitting element disposed between the first electrode and the second electrode, a first conductive contact pattern disposed on the first electrode and electrically contacting the first electrode and an end of the at least one light emitting element, and a second conductive contact pattern disposed on the second electrode and electrically contacting the second electrode and another end of the at least one light emitting element.

A method of transferring a micro light emitting diode (LED) to a pixel array panel includes transferring the micro LED by spraying using an inkjet method, wherein the micro LED comprises an active layer comprising a first portion emitting light in a first direction and a second portion emitting the light in a second direction different from the first direction.

A display device includes a first substrate; a first conductive pattern, a first voltage line and a second voltage line on the first substrate; an insulating layer on the first conductive pattern and the second voltage line; a plurality of first light-emitting elements on the insulating layer; a first electrode on the insulating layer and connected to the first conductive pattern, the first electrode overlapping the first voltage line; and a second electrode on the insulating layer and connected to the second voltage line, wherein the plurality of first light-emitting elements are in contact with the first electrode and the second electrode, and wherein a part of an upper surface of the first electrode that overlaps the first conductive pattern and a part of the upper surface of the first electrode that overlaps the first voltage line are located on the same plane.

A method of manufacturing display device is disclosed. a substrate includes a basal layer and metal contacts on the top surface. An insulation layer is disposed on the top surface and includes a first mounting surface and a bottom surface. Multiple grooves are formed on the insulation layer and each extends from the first mounting surface to the bottom surface. The grooves respectively correspond to the metal contacts and expose respective metal contacts. An electromagnetic force is provided with a direction from the basal layer toward the insulation layer. A droplet containing multiple micro components is provided on the first mounting surface. A configuration of an electrode of the micro component corresponds to a configuration of one of the grooves. The electrode is attracted to the corresponding groove by the electromagnetic force so as to electrically contact the metal contact.

A display device includes: a pixel circuit layer including a plurality of transistors; first partition wall and a second partition wall on the pixel circuit layer, each of the first and second partition walls having a shape protruding in a thickness direction; a first electrode and a second electrode on the same layer and respectively on the first partition wall and the second partition wall; a light emitting element between the first electrode and the second electrode; and a semiconductor pattern directly on the first electrode.

A method of manufacturing display device is disclosed. a substrate includes a basal layer and metal contacts on the top surface. An insulation layer is disposed on the top surface and includes a first mounting surface and a bottom surface. Multiple grooves are formed on the insulation layer and each extends from the first mounting surface to the bottom surface. The grooves respectively correspond to the metal contacts and expose respective metal contacts. An electromagnetic force is provided with a direction from the basal layer toward the insulation layer. A droplet containing multiple micro components is provided on the first mounting surface. A configuration of an electrode of the micro component corresponds to a configuration of one of the grooves. The electrode is attracted to the corresponding groove by the electromagnetic force so as to electrically contact the metal contact.