Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/95
at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
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H01L2224/9512
Aligning the plurality of semiconductor or solid-state bodies
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H01L2224/95143
Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
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H01L2224/95147
by molecular lock-key, e.g. by DNA
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H01L2224/95147

FULL-COLOR LED DISPLAY USING ULTRA-THIN LED ELEMENT AND METHOD FOR MANUFACTURING THEREOF
20220310884 · 2022-09-29 · ·

The present disclosure relates to a full-color light-emitting diode (LED) display, and more particularly, to a full-color LED display using an ultra-thin LED element and a manufacturing method thereof.

Full-color LED display using ultra-thin LED element and method for manufacturing thereof
12266740 · 2025-04-01 · ·

The present disclosure relates to a full-color light-emitting diode (LED) display, and more particularly, to a full-color LED display using an ultra-thin LED element and a manufacturing method thereof.

FULL-COLOR LED DISPLAY USING ULTRA-THIN LED ELEMENT AND METHOD FOR MANUFACTURING THEREOF
20250385225 · 2025-12-18 · ·

The present disclosure relates to a full-color light-emitting diode (LED) display, and more particularly, to a full-color LED display using an ultra-thin LED clement and a manufacturing method thereof.