H
ELECTRICITY
H
ELECTRICITY
H01
ELECTRIC ELEMENTS
H01
ELECTRIC ELEMENTS
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2225/00
Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
H01L2225/00
Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
H01L2225/03
All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
H01L2225/03
All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
H01L2225/04
the devices not having separate containers
H01L2225/04
the devices not having separate containers
H01L2225/065
the devices being of a type provided for in group H01L27/00
H01L2225/065
the devices being of a type provided for in group H01L27/00
H01L2225/06503
Stacked arrangements of devices
H01L2225/06503
Stacked arrangements of devices
H01L2225/06513
Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
H01L2225/06513
Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps