H01L23/28
Encapsulations, e.g. encapsulating layers, coatings,; e.g. for protection
H01L23/28
Encapsulations, e.g. encapsulating layers, coatings,; e.g. for protection
H01L23/3171
the coating being directly applied to the semiconductor body, e.g. passivation layer
H01L23/3171
the coating being directly applied to the semiconductor body, e.g. passivation layer