A power semiconductor module includes: at least one semiconductor substrate having a dielectric insulation layer and a first metallization layer attached to the dielectric insulation layer; at least one semiconductor body arranged on the first metallization layer; at least one end stop element arranged either on the semiconductor substrate or on one of the at least one semiconductor body and extending from the semiconductor substrate or the respective semiconductor body in a vertical direction that is perpendicular to a top surface of the semiconductor substrate; and a housing at least partly enclosing the semiconductor substrate, the housing including sidewalls and a cover. The housing further includes at least one press-on pin extending from the cover of the housing towards one of the at least one end stop element, and exerting a pressure on the respective end stop element.

A system for cooling computer hardware includes a first heat exchanger and a pump. The first heat exchanger includes a computer hardware contact surface configured to be in thermal contact with the computer hardware on a first side and to be in thermal contact with a cooling liquid on a second side. The first heat exchanger also includes a liquid chamber having a pump interface with at least one chamber inlet and at least one chamber outlet. The pump includes a chamber interface with at least one pump outlet and at least one pump inlet. The pump is configured to: detachably connect at the chamber interface to the pump interface, and drive the cooling liquid from a second heat exchanger to the at least one pump outlet and from the at least one a pump inlet to the second heat exchanger.

A system for cooling computer hardware includes a heat exchanger having a computer hardware contact surface configured to be in thermal contact with the computer hardware on a first side and to be in thermal contact with a cooling liquid on a second side, the second side being opposite to the first side. The system also includes a bracket configured to removably clamp the heat exchangerto the computer hardware.

A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a heatsink, a base of the heatsink to be thermally coupled to a semiconductor device, and a rigid plate to be coupled to the semiconductor device and the base of the heatsink, the rigid plate stiffer than the base, the rigid plate distinct from a bolster plate to which the heatsink is to be coupled.

An information handling system includes a heatsink interface component, a printed circuit board assembly, and an upstream heatsink. The heatsink interface component aligns the upstream heatsink on the printed circuit board assembly. The heatsink interface component includes first, second, third, and fourth sides. The heatsink interface component also includes multiple posts. Each of a first set of the posts is located on a top surface of the second side, and each of a second set of the posts is located on a top surface of the fourth side. The heatsink interface component also includes recesses located within the second and fourth sides. Each of a first set of the recesses extends from a bottom surface to the top surface of the second side, and each of a second set of the recesses extends from a bottom surface to the top surface of the fourth side.

Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a carrier plate including a first surface to face a heatsink; a second surface opposite the first surface, and an aperture extending between the first and second surfaces, the aperture dimensioned to surround a semiconductor device, and a spring carried by the carrier plate, the spring to contact a surface of the semiconductor device proximate an outer edge of the semiconductor device.

Example integrated separator devices for hardware component separation are disclosed herein. An example apparatus include a processor carrier having an inner edge and an outer edge; and a component separator rotatably coupled to the processor carrier, the component separator including a shaft, an entirety of the component separator closer to a center of the processor carrier than the outer edge is to the center of the processor carrier.

An electronic package, in which a heat dissipation structure is disposed on a carrier structure to form a packaging space for electronic components to be accommodated in the packaging space, and the electronic components are completely encapsulated by a heat dissipation material to prevent the electronic components exposing from the heat dissipation material so as to improve the heat dissipation effect.

An on-board computer includes a microprocessor chip with a lower face and an upper face, a chip carrier having an upper face on which the microprocessor chip is mounted, and a casing configured to discharge heat generated by the microprocessor chip in operation. An interposer is disposed between the upper face and the casing. The interposer diffuses the heat transmitted by the upper face of the microprocessor chip towards the casing. The interposer has an upper surface for heat exchange with the casing that is twice or more greater than the surface area of the upper face of the microprocessor chip. The interposer has on one or more sides a peripheral wedging rim coming into contact with a side wall of the chip carrier, and has no more than two peripheral wedging rims, in order to leave the other sides of the interposer free.