An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat sink body, and a heat transfer assembly between the heat generating component and the heat sink body. The heat transfer assembly may include a flexible, heat conductive layer having a first portion in thermal contact with the heat generating component and a second portion in thermal contact with the heat sink body. The first and second portions are thermally coupled, and a compressible layer is between the first and second portions of the flexible, heat conductive layer.

An electric power-steering control device has a substrate, a heat-generating component, and a heat-storing body. The heat-generating component is disposed on one surface of the substrate and generates heat when activated. The heat-storing body is capable of storing the heat from the heat-generating components. The heat-storing body has a main body having a rectangular plate shape and disposed on the one surface of the substrate. The heat-storing body has a notch section or a recess section.

In one aspect, a device may include a housing, at least one processor within the housing, storage accessible to the at least one processor and within the housing, and plural heat absorbers within the housing that may be spherical. Each heat absorber may include an outer shell and inner material. The outer shell may include a shape-memory material. The inner material may include phase-change material different from the shape-memory material. The melting point of the phase-change material may be lower than the melting point of the shape-memory material. The heat absorbers may be juxtaposed with one or more other components of the device to absorb heat from the one or more other components.

A thermal module with a heat pipe configured on a first portion having a constant cross-section thickness and a tapered second end configured for contact with a fin stack. The heat pipe is tapered along a length of the second portion such that the cross-section thickness of the heat pipe decreases toward the end of the heat pipe. A fin stack coupled to the tapered portion comprises a plurality of fins of different heights, wherein the fin heights increase such that the combined fin height and heat pipe cross-section thickness remains approximately constant over the width of the fin stack. The tapered heat pipe and fin stack with fins with increasing fin heights provide increased cooling and decreased airflow impedance through the fin stack.

An integrated circuit assembly may be formed using a phase change material as an electromagnetic shield and as a heat dissipation mechanism for the integrated circuit assembly. In one embodiment, the integrated circuit assembly may comprise an integrated circuit package including a first substrate having a first surface and an opposing second surface, and at least one integrated circuit device having a first surface and an opposing second surface, wherein the at least one integrated circuit device is electrically attached by the first surface thereof to the first surface of the first substrate; and a phase change material formed on the integrated circuit package.

An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat sink body, and a heat transfer assembly between the heat generating component and the heat sink body. The heat transfer assembly may include a flexible, heat conductive layer having a first portion in thermal contact with the heat generating component and a second portion in thermal contact with the heat sink body. The first and second portions are thermally coupled, and a compressible layer is between the first and second portions of the flexible, heat conductive layer.

A package substrate, upon which integrated circuit device(s) of an integrated circuit assembly are electrically attached, may include at least one internal fluid conduit that allows for a heat transfer fluid of the two-phase immersion system to transfer heat within the integrated circuit assembly. The at least one internal fluid conduit may comprise at least one fluid channel formed within the package substrate and at least one fluid port extending from an external surface of the package substrate to the at least one fluid channel. The at least one fluid channel may be formed within the package substrate during the formation thereof, then, after the formation of the package substrate, the fluid channels may be “opened” by forming the at least one fluid port.

A heat dissipation structure is provided. The heat dissipation structure includes a heat dissipation unit and a fixation unit. The fixation unit has a bottom and a wall that jointly define a hollow area. The fixation unit is surroundingly arranged on a periphery of a heating source. The hollow area has a first non-masking area, a second non-masking area, and a masking area. The masking area corresponds to at least one part of the heat dissipation unit, and the first non-masking area and the second non-masking area are respectively arranged on opposite sides of the masking area. The first non-masking area has a first volume, the second non-masking area has a second volume, and a sum of the first volume and the second volume is at least greater than a predetermined volume change of the heat dissipation unit.

A heatsink can include a body, one or more thermal fin arrays defined by and/or extending from the body, and a phase change material disposed in contact with the one or more fin arrays. The phase change material can be configured to be a first phase in a cool state and a second phase in a heated state. The phase change material is configured to be cooled back to the solid state.

An antenna assembly is provided having passive cooling elements that enable compact design. In one example, an antenna assembly is provided that includes a heat sink assembly having an interior side and an exterior side, an antenna array, an antenna circuit board, and a radome. The antenna circuit board includes at least one integrated circuit (IC) die. The IC die has a conductive primary heat dissipation path to the interior side of the heat sink assembly. The radome is coupled to the heat sink assembly and encloses the antenna circuit board and the antenna array between the radome and the heat sink assembly. The heat sink assembly includes a metal base plate and at least a first heat pipe embedded with the metal base plate. The first heat pipe is disposed between the metal base plate and the IC die.