Provided is an evaporator stack. The evaporator stack may be used in power-dense electronic assemblies. The evaporator stack includes a lower floor including at least one mounded portion, and an enclosure surrounding the lower floor, wherein a height of the enclosure is greater than a height of the at least one mounded portion, the at least one mounded portion extending between two walls of the enclosure.

Apparatuses, systems, and techniques to cool computer processors. In at least one embodiment, a system comprises one or more processors and a heatsink connected by a flexible heat conduit to the one or more processors, and a position of the heatsink is adjustable.

Heat is transferred to a cold plate from one or more subassemblies in an array of subassemblies in an electronic package. The cold plate has a thermally conductive cold plate substrate, a pressure header, a pressure passage, and one or more pressure connections. Each of the pressure connections connects through a housing opening to housing volume defined by a flexible housing in an encapsulated liquid thermal interface (LTI). The flexible housing is in physical and thermal contact with one of the subassemblies through a housing bottom and a top surface of one or more components in the subassembly. A thermally conductive fluid fills the housing volume, housing opening, pressure connections, pressure passage, and pressure header which are all in fluid communication along with one or more other connections, housing openings, and LTIs on other subassemblies. The system transfers heat from the subassemblies to the cold plate while maintaining a constant pressure/stress on each of the subassemblies. The system pressure on each of the subassemblies is equal. The system pressure can be controlled to a preloaded pressure to insure good electrical contact between components. Shear on the subassemblies is minimized by the LTIs.

Thermal management devices, systems, and methods of fabrication thereof are generally directed to accommodating variability in height, shape, or other geometric features of one or more heat-dissipating components on a substrate while maintaining efficient transfer of heat away from the one or more heat-dissipating components. For example, a thermal management device may include a housing, a diaphragm, and a wick, the wick disposed along a chamber defined by the housing and the diaphragm such that a fluid within the chamber may evaporate and condense along the chamber to transfer heat away from one or more heat-dissipating components (e.g., electronic components or photonics). The diaphragm may be resiliently flexible relative to the housing to bias a contact surface of the diaphragm against one or more heat-dissipating components while maintaining efficient transfer of heat through the chamber and away from the one or more heat-dissipating components.

The waterproof casing has a housing and a grommet. The grommet is disposed in a hole of the housing. The grommet has a body, a flange, and a lip. The flange extends radially outward from the body. The lip protrudes from an outer peripheral part of the body and extends in a circumferential direction. The lip has a high compression portion in contact with a wall surface of the hole and a low compression portion adjacent to the high compression portion at a further side from the flange. The low compression portion has a lower compressed state than the high compression portion. The housing has a recess to allow the low compression portion to escape radially outward.

A cooling device configured to cool a heat source includes a tank, a bellow and a solenoid valve. The tank contains a coolant, and the heat source is immersed in the coolant. The solenoid valve includes a first channel, a second channel, a third channel and a piston. The first channel is connected to the tank. The second channel is connected to the bellow. The third channel is connected to an external space. The piston is configured to seal the second channel and the third channel. The piston is configured to connect the first channel to one of the second channel and the third channel. When the heat source is initially activated, the piston is moved to connect the first channel to the third channel. When the heat source operates, the piston is moved to connect the first channel to the second channel.

A semiconductor device may be provided with a first member, a second member joined to a first region of the first member via a first solder layer and a third member joined to a second region of the first member via a second solder layer. The first region and the second region are located on one side of the first member. The first solder layer contains a plurality of support particles that is constituted of a material having a higher melting point than the first solder layer. The second solder layer does not contain any support particles.

Apparatuses, systems, and techniques to cool computing devices. In at least one embodiment, a system includes a heatsink including one or more connector pins to laterally couple the heatsink to one or more computing devices.

Provided is an evaporator stack. The evaporator stack may be used in power-dense electronic assemblies. The evaporator stack includes a lower floor including at least one mounded portion, and an enclosure surrounding the lower floor, wherein a height of the enclosure is greater than a height of the at least one mounded portion, the at least one mounded portion extending between two walls of the enclosure.

A water cooling module includes a flow-guiding main body and a pump set. The flow-guiding main body includes a first inlet, a first outlet and a flow-guiding passage set. The flow-guiding passage set includes a plurality of flow-guiding passages, and the first inlet and the first outlet are respectively communicable with one of the flow-guiding passages. The pump set includes a first pump having a first water inlet and a first water outlet, and a second pump having a second water inlet and a second water outlet. The first water inlet and the first water outlet are respectively communicable with one of the flow-guiding passages; the second water inlet and the second water outlet are also respectively communicable with one of the flow-guiding passages.