A heat sink comprising a body non-adjustably mountable on a support provided with at least one element to be cooled, characterized in that said body comprises at least one insert that is adjustably fitted therein so that an insert contact surface comes into contact with the element to be cooled.

A cooling device for dissipating heat from articles to be cooled, such as power electronic modules, having at least one preferably rigid heat sink which consists in particular of solid material, preferably composed of metal, for example composed of aluminium, and which is intended to absorb heat from one or more articles to be cooled, and having a cooling fluid chamber for accommodating cooling fluid, in particular cooling liquid, to which the heat absorbed by the heat sink can be transferred. The cooling device has at least two preferably rigid heat sinks which consist in particular of solid material and which are connected to one another in an articulated manner, in particular by way of a heat sink joint, in such a way that the two heat sinks are movable relative to one another in different, in particular parallel planes.

An arrangement having a cooling device for dissipating heat from articles to be cooled which has at least one heat sink that has a heat absorption surface composed of metal and that is intended to absorb heat from one or more articles to be cooled, and also a cooling fluid chamber for accommodating cooling fluid to which the heat absorbed by the heat sink can be transferred, and having at least one article to be cooled which has a preferably planar heat emission surface composed of metal. To optimize the heat conduction between the heat sink and the article to be cooled, the heat absorption surface of the heat sink bears directly against the heat emission surface of the article to be cooled without an intermediate layer composed of air-displacing material, or, if necessary, with the use of an intermediate layer composed of air-displacing material that is thin.

A chip module includes a circuit board (2), a slot (21) disposed on a surface of one side of the circuit board (2), a lidless packaged chip (5), a heat radiator (4), and a substrate fixing assembly (6). The lidless packaged chip (5) includes a substrate (51) and a die (52) packaged on the substrate (51). The slot (21) is electrically connected to the circuit board (2), the lidless packaged chip (5) has a connecting part on one side of the substrate (51) facing away from the die (52), and the connecting part is inserted into the slot (21). The heat radiator (4) is press-fitted on one side of the die (52) facing away from the circuit board (2). The substrate fixing assembly (6) is press-fitted at a periphery of one side of the substrate (51) facing away from the circuit board (2) and avoids the die (52).

Various semiconductor chip packages are disclosed. In one aspect, a semiconductor chip package is provided that includes a package substrate that has a first edge and a second edge opposite to the first edge. A semiconductor chip is mounted on the package substrate. A thermal interface material is positioned on the semiconductor chip. A lid is positioned over the thermal interface material. A spring biasing mechanism is included that is operable to bias the lid away from the package substrate so that the lid, when subjected to a compressive force, can translate toward the package substrate and impart a compressive force on the thermal interface material.

Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.

This disclosure describes an electronics device that effectively removes heat from the SoC, which increases its efficiency and extends its useful life by spreading heat in the thermally conductive plate before transferring it across the interface. Surface area is a significant factor in TIM thermal performance, so this increases the performance substantially when using the same type of TIM pad. This device allows the use of lower performance TIM pads that resolve the issues of high die pressure and non-resilient behavior of high thermal conductivity TIMs. Additionally, the device mechanically isolates the SoC from the heatsink, which reduces stress and provides improved thermal performance.

An apparatus and corresponding approaches for a combined energy dissipation include an energy dissipater forming a hollow chamber therein containing a partial pressure working fluid and a first adjustable thermal connector configured to be placed in an opening of the energy dissipater between an energy generating component to transfer energy there between. The first adjustable thermal connector includes a heat spreader at least partially disposed within the opening of the dissipater, an elastic member operably coupled to the energy dissipater, a flexible membrane coupled to the energy dissipater and the heat spreader, and a phase change material configured to at least partially fill an area defined by the opening, heat spreader, elastic member, and flexible membrane. Upon changing the phase change material to a first material phase, the elastic member applies a biasing force to the energy generating component to align the heat spreader with the energy generating component.

A heatsink for distributing heatsink load across a processor module with separable input/output (I/O) connectors, comprising: a thermal conductor; and one or more pistons aligned with one or more separable interconnects of the processor module.

The power on wafer assembly can include: a compliant connector, an integrated circuit, a printed circuit board (PCB), a power component, and a set of compliant connectors. The power on wafer assembly can optionally include: a compression element, a cooling system, a set of mechanical clamping components, and a power source. However, the power on wafer assembly can additionally or alternately include any other suitable components.