A heat discharge device having a bottom plate having a bottom and an upper surface. Heat discharge blades extend between two front faces of the bottom plate and inclinations of the heat discharge blades are configured in a way such that neighbouring heat discharge blades alternatingly approach one another and move away from each other. Neighbouring heat discharge blades are connected to one another at the end regions facing away from the upper surface of the bottom plate directly and delimit a first air flow channel. Neighbouring heat discharge blades delimit a second air flow channel, which is open at the side facing away from the upper surface of the bottom plate. The heat discharge blades have a group of air vents, wherein the first air flow channels are open at the opposite distal ends thereof and the second air flow channels are closed at the opposite distal ends thereof.

A 3D integrated circuit device can include a substrate, a thermal interface layer and at least one die, at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die, and a heat sink located adjacent to a heat spreader, wherein the thermal interface layer, the at least one die and the at least one device layer are located between the heat spreader and the substrate.

A 3D integrated circuit device can include a substrate, a thermal interface layer and at least one die, at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die, and a heat sink located adjacent to a heat spreader, wherein the thermal interface layer, the at least one die and the at least one device layer are located between the heat spreader and the substrate.

A sensor apparatus includes a sensor having a field of view, a sensor window through which the field of view extends; an air nozzle positioned to direct airflow across the sensor window; a surface fixed relative to the sensor window, the surface including a plurality of heat-dissipation fins; and a cover extending over the fins and including an inlet. The inlet is positioned at an opposite edge of the sensor window from the air nozzle. The air nozzle is aimed at the inlet.

A sensor apparatus includes a sensor having a field of view, a sensor window through which the field of view extends; an air nozzle positioned to direct airflow across the sensor window; a surface fixed relative to the sensor window, the surface including a plurality of heat-dissipation fins; and a cover extending over the fins and including an inlet. The inlet is positioned at an opposite edge of the sensor window from the air nozzle. The air nozzle is aimed at the inlet.

A heatsink is used with a fluid flow generator that rotates about a central axis extending vertically. The heatsink includes a main body section having a top surface facing the fluid flow generator in a vertical direction, and fins that extend upward from the top surface so as to define a plurality of flow passages. The plurality of flow passages form a plurality of fluid paths, each of which has an inlet for the fluid discharged from the fluid flow generator to flow in, and an outlet for discharging to outside the fluid that has entered through the inlet. At least one of the plurality of fluid paths has a first branch section for branching from a first fluid path on downstream of the inlet, and a first joining section for joining a second fluid path having another inlet, on downstream of the first branch section.

A cooling structure includes: a main body including a base, and heat dissipation fins and a protrusion that protrude from a heat dissipation surface; a lid member disposed to cover the protrusion and the fins and form a flow path; and a fan mechanism. The fan mechanism includes a vane portion, a driving portion that rotates the vane portion, and a conductive wire for supplying electric power to the driving portion. The protrusion includes a first through hole, and the base includes a second through hole communicating with the first through hole. The conductive wire includes a first portion connected to the driving portion and disposed between the lid member and the main body, and a second portion continuing from the first portion and inserted in the first through hole and the second through hole. The cooling structure enables enhancement of the heat dissipation and shielding performance.

In one embodiment, the disclosure relates to a system of stacked and connected layers of circuits that includes at least one pair of adjacent layers having very few physical (electrical) connections. The system includes multiple logical connections. The logical interconnections may be made with light transmission. A majority of physical connections may provide power. The physical interconnections may be sparse, periodic and regular. The exemplary system may include physical space (or gap) between the a pair of adjacent layers having few physical connections. The space may be generally set by the sizes of the connections. A constant flow of coolant (gaseous or liquid) may be maintained between the adjacent pair of layers in the space.

In one embodiment, the disclosure relates to a system of stacked and connected layers of circuits that includes at least one pair of adjacent layers having very few physical (electrical) connections. The system includes multiple logical connections. The logical interconnections may be made with light transmission. A majority of physical connections may provide power. The physical interconnections may be sparse, periodic and regular. The exemplary system may include physical space (or gap) between the a pair of adjacent layers having few physical connections. The space may be generally set by the sizes of the connections. A constant flow of coolant (gaseous or liquid) may be maintained between the adjacent pair of layers in the space.

A fluidic device is disclosed, comprising an enclosed passage that is adapted to convey a circulating fluid. The enclosed passage comprises a flow unit having a first electrode and a second electrode offset from the first electrode in a downstream direction of a flow of the circulating fluid. The first electrode is formed as a grid structure and arranged to allow the circulating fluid to flow through the first electrode. The fluidic device may be used for controlling or regulating the flow of the fluid circulating in the enclosed passage, and thereby act as a valve opening, reducing or even closing the passage.