A foil-based package and a method for manufacturing a foil-based package includes, among other things, a first and a second foil substrate. An electronic component is arranged between the two foil substrates in a sandwich-like manner. Due to the component thickness, there is a distance difference between the two foil substrates between the mounting area of the component and ears outside of the mounting area. The foil-based package and the method provides means for reducing and/or compensating a distance difference between the first foil substrate and the second foil substrate caused by the component thickness.

A package including a frame having an opening for receiving a sensor module, wherein the frame comprises at least one electrical connection which is directed into the opening and which is arranged on an insulation layer applied to the frame, and wherein the insulation layer is connected to the frame at an insertion side of the frame, from which side the sensor module is to be inserted into the opening, and is bent along the inner side of the frame proceeding from the insertion side, such that the at least one electrical connection directed to the opening is electrically couplable to the associated sensor module connection in an arrangement.

A method for producing a document structure, wherein the method includes producing a chip structure by forming a cavity in a carrier having a top side and an under side, picking up a chip having at least one chip contact and a redistribution layer (RDL) connected to the at least one chip contact by means of a picking-up device detaching the chip from an auxiliary carrier, wherein the chip bears on the auxiliary carrier by way of the RDL, wherein the chip is lifted up from the auxiliary carrier by means of pressure being exerted on the RDL, wherein the lifted-up chip is picked up and inserted into the cavity, and wherein the RDL is oriented on the top side of the carrier, fixing the chip in the cavity by means of an adhesive, electrically conductively connecting the at least one chip contact of the RDL to an electrically conductive region of the carrier by means of an electrically conductive material, and embedding the carrier between a first paper layer and a second paper layer.

A chip module having a chip coupled to at least one electrically conductive region including a metal, and a coating of the at least one electrically conductive region with a layer of at least one organic silicon compound and/or a form of carbon in a thickness having an electrical surface contact resistance of not more than 500 mΩ according to ISO 7810 in a measurement in accordance with ISO 10373-1.

Example embodiments of systems and methods for milling patterns for a card are provided. A chip fraud prevention system include a device including a chip. The chip may be at least partially encompassed in a chip pocket. The chip pocket may include one or more shapes. The one or more shapes may include one or more peaks and one or more valleys. One or more connections may be communicatively coupled to at least one surface of the chip. The one or more connections may be placed between at least one of the one or more peaks or one or more valleys.

Flexible devices including conductive traces with enhanced stretchability, and methods of making and using the same are provided. The circuit die is disposed on a flexible substrate. Electrically conductive traces are formed in channels on the flexible substrate to electrically contact with contact pads of the circuit die. A first polymer liquid flows in the channels to cover a free surface of the traces. The circuit die can also be surrounded by a curing product of a second polymer liquid.

Provided among other things is a method of affixing a small, single chip to a plastic item, the chip having a top surface having length and width dimensions, and having a height, the method comprising: (1) vacuum adhering a top-oriented surface of the chip to a probe of outer dimensions comparable to or smaller than those of the length and width; (2) conveying heat to the chip via the probe such that a bottom-oriented surface of the chip is sufficiently hot to melt the plastic; (3) applying via the probe the chip to the plastic such that the chip embeds in the plastic; and (4) releasing the chip from the probe, wherein the largest of the length and width is about 500 microns or less, and height is no more than about the smallest of length and width.

A lead frame used to assemble a semiconductor device, such as a smart card, has a first major surface including exposed leads and a second major surface including a die receiving area and one or more connection pads surrounding the die receiving area. The connection pads enable electrical connection of an Integrated Circuit (IC) die to the exposed leads. A molding tape sized and shaped like the lead frame is adhered to and covers the second major surface of the lead frame. The molding tape has a die receiving area cut-out that exposes the die receiving area and the connection pads on the second major surface of the lead frame and forms a cavity for receiving an encapsulant. The cut-out has an elevated sidewall for retaining the encapsulant within the cavity.

The invention relates to an electronic module (30) intended to be held in place on a carrier (1) by a holding means (4), the electronic module (30) consisting of a plurality of layers, comprising a first carrier layer (10) carrying one or more contacts (11), a first face (10b) of the carrier layer (10) is in contact with a first face (12a; 53a) of a substrate (12; 53) and comprising a face of the substrate (12b; 53b) carrying one or more antennas (13; 50, 51), the antenna(s) (13; 50, 51) being connected to an integrated circuit (14) via feeder links (15). The electronic module (30) comprises at least one stay-in-place safety layer (31) arranged between the first carrier layer (10) and the substrate (12), the safety layer (31) being an adhesive layer, the safety layer (31) having technical features such that the binding forces Fad1 of the layer are lower than the binding forces Fad2 of the holding means (4) so as to cause the rupture of the feeder links (15) by the action of a tensile force exerted on the electronic module.

When forming smartcards or pre-forms thereof additional functionality may be implemented by, for instance, incorporating components, such as a display device, and the like, by preparing pre-packages separately from the rest of the pre-forms and subsequently inserting the pre-packages into the pre-forms, thereby achieving superior process robustness and production yield.