H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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24/00
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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H01L24/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L24/18
High density interconnect [HDI] connectors; Manufacturing methods related thereto
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H01L24/23
Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
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H01L24/24
of an individual high density interconnect connector
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