In an embodiment an optical component includes an optical body at least partially translucent to visible light and a coating directly arranged at the optical body, wherein the coating has a reflection coefficient of at least 0.8 for at least one wavelength range in a range from 380 nm to 1500 nm and an average thickness between 10 μm and 200 μm inclusive, wherein the coating has a polysiloxane as base material, and wherein the polysiloxane comprises —SiO.sub.3/2 units.

An inkjet printing device includes a stage; an inkjet head disposed above the stage and comprising nozzles through which ink is discharged, the ink including bipolar elements extending in a direction; an ink circulation part which supplies the ink to the inkjet head, and to which the ink remaining after being discharged from the inkjet head is supplied; and at least one sensing part disposed between the inkjet head and the ink circulation part and sensing a number of the bipolar elements that are discharged through the nozzles.

A display apparatus includes: a light-emitting device layer provided to extend over a plurality of pixels arranged two-dimensionally; a phosphor layer separated by a partition wall for each of the pixels; and a bonding structure sandwiched between the light-emitting device layer and the phosphor layer, and in which a first oxidation film, a bonding oxidation film, and a second oxidation film are stacked in order from the light-emitting device layer side.

A black matrix substrate assembly including a transparent substrate, a black matrix pattern, a transparent resin layer, a resin wall pattern, a light reflective layer, and a transparent protective layer. The black matrix pattern includes first and second black linear segments with a width Ax of each first segment in a first direction. The resin wall pattern includes first and second wall linear segments with a width Dx of each first segment smaller than the width Ax in the first direction and the center line of each first segment aligned with that of the corresponding first black linear segment. The light reflective layer includes first and second reflective linear segments with a width Cx of each first segment larger than the width Dx in the first direction and the center line of each first segment aligned with that of the corresponding first black linear segment.

A display device includes a pixel array substrate and a circuit board. The pixel array substrate has a first surface, a second surface opposite to the first surface, and a first side surface connecting the first surface and the second surface. Multiple bonding pads are located on the first surface. The circuit board is bent from above the first surface of the pixel array substrate to below the second surface. The circuit board is electrically connected to the bonding pads and includes a thermoplastic substrate. The thermoplastic substrate includes a third surface facing the pixel array substrate and a fourth surface opposite to the third surface. The thermoplastic substrate includes a first bend formed by thermoplastics.

A light emitting diode package includes: a housing including a cavity region therein; a light emitting diode chip mounted in the cavity region of the housing; and a resin part formed in the cavity region to cover a light emitting surface of the light emitting diode chip. The housing includes a first surface and a second surface perpendicular to a width direction of the housing and spaced apart from each other, and a third surface and a fourth surface perpendicular a longitudinal direction of the housing and spaced apart from each other, in which the first surface and the second surface surround the resin part while the third surface and the fourth surface expose side surfaces of the resin part.

The disclosure relates to a micro component structure and a manufacturing method thereof, and a transfer method for a light-emitting diode (LED) chip. The micro component structure includes a substrate (300), multiple stacked adhesive layer structures spaced on a first surface (300a) of the substrate (300), and multiple LED chips (20) correspondingly disposed on the multiple stacked adhesive layer structures. Each of the multiple LED chips (20) has two extraction electrodes (21) at a surface facing toward the multiple stacked adhesive layer structures. Each of the multiple stacked adhesive layer structures includes a photolysis adhesive layer (31′) and a pyrolysis adhesive layer (32′) that are stacked. The photolysis adhesive layer (31′) is in contact with the first surface (300a). The pyrolysis adhesive layer (32′) is located between the two extraction electrodes (21) and has a thickness greater than a height of each of the two extraction electrodes (21).

A display device and method for fabrication thereof includes a plurality of pixel electrodes and common electrode connection parts that are spaced from each other on a first substrate, a plurality of light emitting elements on the plurality of pixel electrodes, a plurality of common electrode elements on the common electrode connection parts, and a common electrode layer on the plurality of light emitting elements and the plurality of common electrode elements, wherein each of the plurality of light emitting element includes a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, each of the plurality of common electrode elements includes at least the second semiconductor layer, and the common electrode layer includes a same material as the second semiconductor layer to be connected to the second semiconductor layers of the plurality of light emitting elements.

A display device includes pixel electrodes disposed on a substrate, at least one light-emitting element disposed on each of the pixel electrodes, a planarization layer disposed on the pixel electrodes and filling a space between the at least one light-emitting element, and a common electrode disposed on the planarization layer and the at least one light-emitting element. Each of the light-emitting elements is arranged perpendicular to a top face of each of the pixel electrodes, at least one of the pixel electrodes includes a protrusion protruding toward an adjacent one of the pixel electrodes, and the protrusion overlaps the light-emitting element in a plan view.

A display device and method for fabrication thereof are provided. The display device includes a first substrate, pixel electrodes on the first substrate, light emitting elements respectively on the pixel electrodes, and including first semiconductor layers, second semiconductor layers, active layers respectively between the first semiconductor layers and the second semiconductor layers, a first light emitting element including a first active layer of the active layers, a second light emitting element including a second active layer of the active layers that is different from the first active layer, a third light emitting element including a third active layer of the active layers that is different from the first and second active layers, and a fourth light emitting element including a fourth active layer of the active layers that is different from the first to third active layers, and a common electrode layer on the light emitting elements.