A flash memory cell includes a rectifying device and a transistor. The rectifying device has an input end coupled to a bit line. The transistor has a charge storage structure. The transistor has a first end coupled to an output end of the rectifying device, the transistor has a second end coupled to a source line, and a control end of the transistor is coupled to a word line.

A semiconductor device includes a common source region formed in a semiconductor substrate, a bit line formed over the semiconductor substrate, first and second vertical channel layers coupled between the bit line and the common source region, wherein the first and second vertical channel layers are alternately arranged on the semiconductor substrate, first conductive layers stacked over the semiconductor substrate to surround one side of the first vertical channel layer, second conductive layers stacked over the semiconductor substrate to surround one side of the second vertical channel layer, and a charge storage layer formed between the first vertical channel layer and the first conductive layers and between the second vertical channel layer and the second conductive layers.

A three-dimensional semiconductor memory device is provided. A stacked structure is formed on a substrate. The stacked structure includes conductive patterns vertically stacked on the substrate. A selection structure including selection conductive patterns is stacked on the stacked structure. A channel structure penetrates the selection structure and the stacked structure to connect to the substrate. An upper interconnection line crosses the selection structure. A conductive pad is disposed on the channel structure to electrically connect the upper interconnection line to the channel structure. A bottom surface of the conductive pad is positioned below a top surface of the uppermost selection conductive pattern of the selection conductive patterns.

In some embodiments, the present disclosure relates to an integrated chip (IC), including a substrate, a floating gate electrode disposed over the substrate, a contact etch stop layer (CESL) structure disposed over the floating gate electrode, an insulating stack separating the floating gate electrode from the CESL structure, the insulating stack including a first resist protective layer disposed over the floating gate electrode, a second resist protective layer disposed over the first resist protective layer, and an insulating layer separating the first resist protective layer from the second resist protective layer.

A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers, memory stack structures vertically extending through the alternating stack, a retro-stepped dielectric material portion overlying stepped surfaces of the alternating stack, a laterally perforated support pillar structure vertically extending through the alternating stack and the retro-stepped dielectric material portion, and a layer contact via structure laterally surrounded by the laterally perforated support pillar structure and contacting a top surface of a topmost electrically conductive layer within an area of the laterally perforated support pillar structure. Each electrically conductive layer within the area of the laterally perforated support pillar structure extends through the lateral openings.

An integrated circuit includes; a source region arranged in an upper portion of a substrate, a pair of split gate structures respectively on opposing sides of the source region, wherein each of the pair of split gate structures includes a floating gate electrode layer and a control gate electrode layer disposed on the floating gate electrode layer, an erase gate structure between the pair of split gate structures on the source region and including an erase gate electrode layer, a pair of selection gate structures respectively on outer sidewalls of the pair of split gate structures, and a pair of gate spacers, wherein each of the gate spacers is disposed between one of the pair of split gate structures and one of the pair of selection gate structures, includes a first gate spacer and a second gate spacer disposed on the first gate spacer, is further disposed on an outer side wall of the one of the pair of split gate structures, and a lowermost end of the second gate spacer is at a lower level than an upper surface of the floating gate electrode layer.

A semiconductor device includes a substrate provided with a decoupling capacitor and plurality of circuit elements disposed along a first direction, and a plurality of first wiring line patterns disposed in a first wiring line layer over the substrate, including a power routing pattern coupled to the decoupling capacitor and a plurality of internal wiring line patterns coupled to the plurality of circuit elements. The plurality of first wiring line patterns extend in the first direction, and are aligned in conformity with virtual wiring line pattern tracks which are defined at a first pitch along a second direction intersecting the first direction and parallel to the substrate.

A semiconductor memory device includes an electrode structure including a plurality of electrode layers and a plurality of interlayer dielectric layers which are alternately stacked on a source plate defined with a cell area and a connection area in a first direction; a vertical channel passing through the electrode structure in the cell area; a hard mask pattern disposed on the electrode structure in the connection area, and having a plurality of opening holes; a plurality of contact holes defined in the electrode structure under the opening holes, and exposing pad areas of the electrode layers; and a slit dividing the hard mask pattern into units smaller than the electrode structure in the connection area.

A semiconductor device is disclosed. The semiconductor device includes a first slit, at least one word line, and a second slit. The first slit is disposed at a boundary between contiguous memory blocks to isolate the memory blocks from each other, and includes a first outer slit and a second outer slit, the second outer slit is spaced apart in a first direction from the first outer slit by a predetermined distance. The word line is disposed, between the first and second outer slits, including a center region having a first end and a second end, and an edge region located at the first end and a second end of the center region, and the second slit is disposed at the center region that isolate area of the word line in the center region on either side of the second slit, wherein the word line is continuous in the edge regions.

A semiconductor device is provided which includes: a first group including a plurality of first memory blocks; a second group including a plurality of second memory blocks; a first common source line connected to the first group; a second common source line connected to the second group; a source line voltage supplying circuit supplying a source line voltage; a first switch controlling a connection between the first common source line and the source line voltage supplying circuit; and a second switch controlling a connection between the second common source line and the source line voltage supplying circuit. When one first memory block among the plurality of first memory blocks of the first group is selected, the first switch may be turned on, and the second switch may be turned off.