A semiconductor device with different configurations of gate structures and a method of fabricating the same are disclosed. The method includes forming a fin structure on a substrate, forming a gate opening on the fin structure, forming an interfacial oxide layer on the fin structure, forming a first dielectric layer over the interfacial oxide layer, forming a dipole layer between the interfacial oxide layer and the first dielectric layer, forming a second dielectric layer on the first dielectric layer, forming a work function metal (WFM) layer on the second dielectric layer, and forming a gate metal fill layer on the WFM layer. The dipole layer includes ions of first and second metals that are different from each other. The first and second metals have electronegativity values greater than an electronegativity value of a metal or a semiconductor of the first dielectric layer.

A display device includes a substrate having a first surface and a second surface opposite to the first surface. The display device includes a first conductive layer disposed on the first surface and a second conductive layer disposed on the second surface. The first conductive layer and the second conductive layer are disposed on the opposite sides of the substrate. The display device includes a connective portion at least partially disposed in the substrate and penetrating from the first surface to the second surface. The first conductive layer is electrically connected to the second conductive layer through the connective portion. The display device includes a light-emitting element disposed on the first surface and an insulation layer disposed on the first conductive layer. Along a direction perpendicular to the first surface, the first electrode and the second electrode of the light-emitting element are not overlapped with the connective portion.

A display device includes pixels connected to scan lines and data lines intersecting the scan lines, wherein each of the pixels includes a light-emitting element, a driving transistor to control a driving current supplied to the light-emitting element according to a data voltage applied from the data lines, and a switching transistor to apply the data voltage of the data line to the driving transistor according to a scan signal applied from the scan lines. The driving transistor includes a first active layer having an oxide semiconductor and a first gate electrode below the first active layer. The switching transistor includes a second active layer having a same oxide semiconductor as the oxide semiconductor of the first active layer and a second gate electrode below the second active layer. At least one of the driving transistor and the switching transistor includes an oxide layer above each of the active layers.

A display apparatus having a connection electrode which crosses a bending area may be provided. The connection electrode may be disposed on a device substrate including a bending area between a display area and a pad area. The connection electrode may connect the display area and the pad area across the bending area. The connection electrode may have a stacked structure of the lower connecting electrode and the upper connecting electrode. A light-emitting device, an encapsulating element and a touch electrode may be sequentially stacked on the display area of the device substrate. The upper connecting electrode may include the same material as the touch electrode. Thus, in the display apparatus, the disconnection of the connection electrode due to bending stress and external impact may be reduced.

A display device includes a pixel connected to a data line, a data pad connected to the data line, and a first test area. The first test area includes a test control line transmitting a test control signal, a test signal line transmitting a test signal, and a first switch connected to the data pad. The first switch includes a gate electrode connected to the test control line, first and second semiconductor layers overlapping the gate electrode, a source electrode connected to the first and second semiconductor layers, and a drain electrode spaced from the source electrode and connected to the first and second semiconductor layers. The source electrode and the drain electrode are connected to the test signal line and data pad, respectively. One of the first or second semiconductor layers includes an oxide semiconductor and the other of the first or second semiconductor layer includes a silicon-based semiconductor.

According to one embodiment, a semiconductor device includes a first transistor which includes a an oxide semiconductor layer, and a second transistor connected to first and a second gate electrodes of the first transistor, wherein the oxide semiconductor layer is provided between the first and second gate electrodes in a cross-sectional view, the oxide semiconductor layer includes a first channel formation region overlapping the second gate electrode and a second channel formation region not overlapping the second gate electrode in a plan view, and a resistance value between the second gate electrode and the second transistor is higher than a resistance value between the first gate electrode and the second transistor.

A method for making an array substrate includes the following steps: forming a poly-silicon semiconductor layer on a substrate; forming a buffer layer on the substrate; depositing a first metal layer, and patterning the first metal layer to form gate electrodes for a driving TFT, a switch TFT, and a poly-silicon TFT; forming a first gate insulator layer; forming a second gate insulator layer; defining through holes passing through the buffer layer, the first gate insulator layer, and the second gate insulator layer to expose the poly-silicon semiconductor layer; depositing a metal oxide layer to form a first metal oxide semiconductor layer; and depositing a second metal layer to form source electrodes and drain electrodes for the driving TFT, the switch TFT, and the poly-silicon TFT.

A thin film transistor (TFT) substrate and a display device using the same are disclosed. The TFT substrate includes a first TFT including a polycrystalline semiconductor layer, a first gate electrode, a first source electrode, and a first drain electrode deposited on a substrate, a second TFT separated from the first TFT, the second TFT including a second gate electrode, an oxide semiconductor layer, a second source electrode, and a second drain electrode deposited on the first gate electrode, and a plurality of storage capacitors separated from the first and second TFTs, each storage capacitor including a first dummy semiconductor layer, a first gate insulating layer on the first dummy semiconductor layer, a first dummy gate electrode on the first gate insulating layer, and an intermediate insulating layer on the first dummy gate electrode.

An organic light emitting display device includes a driving TFT on the substrate, a switching TFT on the substrate, and an organic light emitting diode. The driving TFT includes a first active layer formed of poly-Si, and at least a first part of an interlayer insulation layer on the first active layer. The interlayer insulation layer is formed of a first material including hydrogen. The switching TFT includes a second active layer, at least a second part of the interlayer insulation layer between the first active layer and the second active layer, and at least a part of a gate insulation layer between the second part of the interlayer insulation layer and the second active layer. The gate insulation layer is formed from a second material different from the first material and blocking diffusion of hydrogen from the interlayer insulation layer to the second active layer.

The semiconductor device comprises a gate electrode, a first gate insulating film overlapping a part of the side surface and the upper surface of the gate electrode, a second gate insulating film overlapping the upper surface of the gate electrode, a semiconductor film provided on the upper surface of the second gate insulating film and overlapping the gate electrode and a first terminal and a second terminal overlapping the upper surface of the semiconductor film. In a plan view, a first region is a region where the semiconductor film overlaps the upper surface of the first gate insulating film and the second gate insulating film between the first terminal and the second terminal, and a third region is a region that overlaps both a part of the upper surface of the gate electrode and the second gate insulating film and does not overlap the first gate insulating film.