A mixed semiconductor-superconductor platform is fabricated in phases. In a masking phase, a dielectric mask is formed on a substrate, such that the dielectric mask leaves one or more regions of the substrate exposed. In a selective area growth phase, a semiconductor material is selectively grown on the substrate in the one or more exposed regions. In a superconductor growth phase, a layer of superconducting material is formed, at least part of which is in direct contact with the selectively grown semiconductor material. The mixed semiconductor-superconductor platform comprises the selectively grown semiconductor material and the superconducting material in direct contact with the selectively grown semiconductor material.

A multi-layer semiconductor structure includes a first semiconductor structure and a second semiconductor structure, with at least one of the first and second semiconductor structures provided as a superconducting semiconductor structure. The multi-layer semiconductor structure also includes one or more interconnect structures. Each of the interconnect structures is disposed between the first and second semiconductor structures and coupled to respective ones of interconnect pads provided on the first and second semiconductor structures. Additionally, each of the interconnect structures includes a plurality of interconnect sections. At least one of the interconnect sections includes at least one superconducting and/or a partially superconducting material.

A quantum processor includes: a first chip comprising a qubit array, in which a plurality of qubits within the qubit array define an enclosed region on the first chip, in which each qubit of the plurality of qubits that define the enclosed region is arranged to directly electromagnetically couple to an adjacent qubit of the plurality of qubits that define the enclosed region, and in which each qubit of the qubit array comprises at least two superconductor islands, and a second chip bonded to the first chip, the second chip including one or more qubit control elements, in which the qubit control elements are positioned directly over the enclosed region of the first chip.

A system includes a first quantum circuit plane that includes a first qubit, a second qubit and a third qubit. A coupled-line bus is coupled between the first qubit and the second qubit. A second circuit plane is connected to the first quantum circuit plane, comprising a control line coupled to the third qubit. The control line and the coupled-line bus are on different planes and crossing over each other, and configured to mitigate cross-talk caused by the crossing during signal transmission.

A parametric amplifier for amplifying an input signal includes a resonator comprising a Josephson junction. The Josephson junction comprises a first superconductor component, a second superconductor component and a semiconductor component. The semiconductor component is configured to enable coupling of the first and second superconductor components. The parametric amplifier further comprises a gate electrode configured to apply an electrostatic field to the semiconductor component of the Josephson junction for tuning the parametric amplifier. Such parametric amplifiers are useful for amplifying signals in the microwave frequency range. Tuning the junction by electrostatic gating may allow for improved scalability compared to tuning using magnetic flux. Also provided are the use of the parametric amplifier to amplify a signal; and a method of amplifying a signal.

A superconductor magnetic field effect transistor. The superconductor magnetic field effect transistor may include a sheet of a superconducting material; and a solenoid. The sheet may be substantially flat, and the solenoid may include a plurality of turns, each of the turns being substantially parallel to the sheet. The superconducting material may be a type-II superconducting material.

A hybrid quantum system performs high-fidelity quantum state transduction between a superconducting (SC) microwave qubit and the ground state spin system of a solid-state artificial atom. This transduction is mediated via an acoustic bus connected by piezoelectric transducers to the SC microwave qubit. For SC circuit qubits and diamond silicon vacancy centers in an optimized phononic cavity, the system can achieve quantum state transduction with fidelity exceeding 99% at a MHz-scale bandwidth. By combining the complementary strengths of SC circuit quantum computing and artificial atoms, the hybrid quantum system provides high-fidelity qubit gates with long-lived quantum memory, high-fidelity measurement, large qubit number, reconfigurable qubit connectivity, and high-fidelity state and gate teleportation through optical quantum networks.

Systems and methods for synchronizing operation of control circuits in quantum circuit assemblies are disclosed. An example assembly for controlling operation of a qubit device includes a plurality of control circuits and an event synchronization arrangement. The plurality of control circuits may include a first and a second control circuits, configured to perform, respectively, first and second actions to control operation of the qubit device. The event synchronization arrangement may be used to control operation of the plurality of control circuits to provide to the second control circuit an indication that the first control circuit performed the first action, and to configure the second control circuit to perform the second action in response to receiving the indication that the first control circuit performed the first action. Assemblies disclosed herein provide improved control over qubits, good scalability in the number of qubits included in the device, and/or design flexibility.

A quantum computing device is fabricated by forming, on a superconductor layer, a first resist pattern defining a device region and a sensing region within the device region. The superconductor layer within the sensing region is removed, exposing a region of an underlying semiconductor layer outside the device region. The exposed region of the semiconductor layer is implanted, forming an isolation region surrounding the device region. Using an etching process subsequent to the implanting, the sensing region and a portion of the device region of the superconductor layer adjacent to the isolation region are exposed. By depositing a first metal layer within the sensing region, a tunnel junction gate is formed. A reflectrometry wire comprising a second metal within the reflectrometry region is formed. A nanorod contact using the second metal within the portion of the device region outside the sensing region is formed.

A stacked quantum computing device including: a first chip including a superconducting qubit, where the superconducting qubit includes a superconducting quantum interference device (SQUID) region, a control region, and a readout region, and a second chip bonded to the first chip, where the second chip includes a first control element overlapping with the SQUID region, a second control element displaced laterally from the control region and without overlapping the control region, and a readout device overlapping the readout region.