Patent classifications
H
H01
H01L
29/00
H01L29/66
H01L29/66007
H01L29/66075
H01L29/66227
H01L29/66946
H01L29/66962
H01L29/66962
Semiconductor devices with via structure and package structures comprising the same
A semiconductor device is provided. The semiconductor device includes a substrate; an active layer disposed on the substrate; a via through the active layer; and a plurality of electrodes disposed on the active layer and into the via. Additionally, a package structure that includes the semiconductor device is also provided. The electrode is electrically connected to the substrate through the via.
SEMICONDUCTOR DEVICES AND PACKAGE STRUCTURES COMPRISING THE SAME
A semiconductor device is provided. The semiconductor device includes a substrate; an active layer disposed on the substrate; a via through the active layer; and a plurality of electrodes disposed on the active layer and into the via. Additionally, a package structure that includes the semiconductor device is also provided.