A qubit device includes a crystal immobilized on a substrate and in contact with electrodes. The crystal exhibits a charge pair symmetry and with an electron current moving clockwise, counter clockwise, or both. The current in can be placed in a state of superposition wherein the current is unknown until it is measured, and the direction of the current is measured to produce a binary output corresponding to a logical zero or a logical one. A state of the qubit device is monitored by measuring a voltage, a current, or a magnetic field and assigning a superposition or base state depending on a threshold value.

A GHeT includes a bottom gate formed on a substrate; a first dielectric layer (DL) formed on the bottom gate; a monolayer film formed of an atomically thin material on the first DL; a bottom contact (BC) formed on part of the monolayer film; a second DL formed on the BC; a top contact (TC) formed on the second DL on top of the BC; a network of CNTs formed on the TC and the monolayer film, to define an overlap region with the monolayer film; a third DL formed on the CNT network, the monolayer film and the TC; and a top gate formed on the third DL and overlapping with the overlap region. Such GHeT design allows gate tunability of Gaussian peak position, height and width that define Gaussian transfer characteristic, thereby enabling simplified circuit architectures for various spiking neuron functions for emerging neuromorphic applications.

An electronic device for storing, controlling and manipulating electron or hole spin based semiconductor qubits, the device including an electrically insulating layer and on a front face of the insulating layer, a trapping structure for electrons or holes which includes: a channel portion including at least one layer portion of semiconductor material, as well as a plurality of gates distributed for trapping at least one electron or hole in the channel portion, and on the back side of the insulating layer, an electrical track extending parallel to the insulating layer, for generating an oscillating magnetic field acting on the at least one electron or hole trapped in the trapping structure.

Disclosed herein are quantum dot devices and techniques. In some embodiments, a quantum computing processing device may include a quantum well stack, an array of quantum dot gate electrodes above the quantum well stack, and an associated array of selectors above the array of quantum dot gate electrodes. The array of quantum dot gate electrodes and the array of selectors may each be arranged in a grid.

A system includes N-distant independent plasmonic graphene waveguides. The N-distant independent plasmonic graphene waveguides are used to generate an N-partite continuous variable entangled state.

A tunneling field effect transistor device disclosed herein includes a substrate, a body comprised of a first semiconductor material being doped with a first type of dopant material positioned above the substrate, and a second semiconductor material positioned above at least a portion of the gate region and above the source region. The first semiconductor material is part of the drain region, and the second semiconductor material defines the channel region. The device also includes a third semiconductor material positioned above the second semiconductor material and above at least a portion of the gate region and above the source region. The third semiconductor material is part of the source region, and is doped with a second type of dopant material that is opposite to the first type of dopant material. A gate structure is positioned above the first, second and third semiconductor materials in the gate region.

An electronic component (10) is formed by a semiconductor component or a semiconductor-like structure having gate electrode assemblies (16, 18), for initializing the quantum mechanical state of a qubit.

One superconducting qubit device package disclosed herein includes a die having a first face and an opposing second face, and a package substrate having a first face and an opposing second face. The die includes a quantum device including a plurality of superconducting qubits and a plurality of resonators on the first face of the die, and a plurality of conductive pathways coupled between conductive contacts at the first face of the die and associated ones of the plurality of superconducting qubits or of the plurality of resonators. The second face of the package substrate also includes conductive contacts. The device package further includes first level interconnects disposed between the first face of the die and the second face of the package substrate, coupling the conductive contacts at the first face of the die with associated conductive contacts at the second face of the package substrate.

An integrated circuit and a method for operating the integrated circuit to perform quantum analog computing. The integrated circuit comprises a plurality of qubits connected to each other, each qubit of the plurality of qubits comprising resistors, inductors, capacitors and a switch, which can be implemented using CMOS elements, wherein the qubits are connected to each other according to a connectivity topology, such as a Hopfield network, that provides an analog of quantum behavior at room temperature.

One-dimensional and two-dimensional arrays of qubits are disclosed. The one-dimensional array includes two or more double-quantum dots embedded in silicon, the two or more double-quantum dots arranged in an Echelon formation, such that the distance between the two or more double-quantum dots is approximately 40 nm and the distance between the two quantum dots in each double-quantum dot is approximately 12 nm; two or more reservoirs to load electrons to the corresponding two or more double-quantum dots to form singlet-triplet qubits in each double-quantum dot; and two or more gates for controlling the formed singlet-triplet qubits. The two-dimensional array of qubits includes two or more layers of vertically-stacked one-dimensional arrays of qubits.