A semiconductor device according to one embodiment includes: a semiconductor chip having a transistor and a drain pad provided on a board; a capacitor having an upper electrode and a lower electrode interposing a dielectric; a pad; and an empty pad provided on the board of the semiconductor chip. The semiconductor device further includes: a first wire connecting the pad and the drain pad of the semiconductor chip to each other; a second wire connecting the empty pad and the upper electrode of the capacitor to each other; and a third wire connecting the pad and the empty pad to each other.

In one example, an electronic device comprises a substrate comprising a dielectric structure and a conductive structure, a first electronic component over a top side of the substrate and coupled with the conductive structure, a lid over the first electronic component and coupled with a top side of the substrate, wherein the lid comprises a top plate having a plurality of holes, and a covering material covering a lateral side of the first electronic component and extending between the top side of the substrate and a bottom side of the top plate of the lid. Other examples and related methods are also disclosed herein.

A semiconductor device according to one embodiment includes: a semiconductor chip having a transistor and a drain pad provided on a board; a capacitor having an upper electrode and a lower electrode interposing a dielectric; a pad; and an empty pad provided on the board of the semiconductor chip. The semiconductor device further includes: a first wire connecting the pad and the drain pad of the semiconductor chip to each other, a second wire connecting the empty pad and the upper electrode of the capacitor to each other, and a third wire connecting the pad and the empty pad to each other.