This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate with the following steps, especially the following sequence: forming a first reservoir in a surface layer on the first contact surface and a second reservoir in a surface layer on the second contact surface, the surface layers of the first and second contact surfaces being comprised of respective native oxide materials of one or more second educts respectively contained in reaction layers of the first and second substrates, partially filling the first and second reservoirs with one or more first educts; and reacting the first educts filled in the first reservoir with the second educts contained in the reaction layer of the second substrate to at least partially strengthen a permanent bond formed between the first and second contact surfaces.

This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate with the following steps, especially the following sequence: forming a reservoir in a surface layer on the first contact surface, the first surface layer consisting at least largely of a native oxide material, at least partial filling of the reservoir with a first educt or a first group of educts, the first contact surface making contact with the second contact surface for formation of a prebond connection, forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate.

A method for applying a bonding layer that is comprised of a basic layer and a protective layer on a substrate with the following method steps: application of an oxidizable basic material as a basic layer on a bonding side of the substrate, at least partial covering of the basic layer with a protective material that is at least partially dissolvable in the basic material as a protective layer. In addition, the invention relates to a corresponding substrate.

A method for preparing a multi-element alloy compound is provided. The method includes the following steps: placing materials to be melted in a high-temperature synthesis zone of a vacuum container after being uniformly mixed, and placing materials to be sublimated in a low-temperature evaporation zone of the vacuum container; heating the materials to be melted in the high-temperature synthesis zone to a molten state to form a molten material; heating the materials to be sublimated in the low-temperature evaporation zone to a gaseous state to allow the sublimated gaseous material to react with the molten material. The prepared multi-element alloy compound, a method for preparing ink by adopting the multi-element alloy compound and the prepared multi-element alloy compound ink, as well as a method for preparing a film absorption layer by adopting the multi-element alloy compound ink and the prepared multi-element alloy compound film absorption layer are provided.

A flexible solar cell chip packaging box includes a housing body and a housing cover. The housing body includes a bottom wall and a first side wall which is perpendicularly and fixedly connected to the bottom wall, the first side wall and the bottom wall enclose a receiving chamber provided with an opening, and the first side wall is provided with a first groove. The housing cover includes a top wall and a second side wall which is perpendicularly and fixedly connected to the top wall, the top wall is covered on the opening, and the second side wall is sleeved on the outside of the first side wall.

A method for applying a bonding layer that is comprised of a basic layer and a protective layer on a substrate with the following method steps: application of an oxidizable basic material as a basic layer on a bonding side of the substrate, at least partial covering of the basic layer with a protective material that is at least partially dissolvable in the basic material as a protective layer. In addition, the invention relates to a corresponding substrate.

A method for applying a bonding layer that is comprised of a basic layer and a protective layer on a substrate with the following method steps: application of an oxidizable basic material as a basic layer on a bonding side of the substrate, at least partial covering of the basic layer with a protective material that is at least partially dissolvable in the basic material as a protective layer. In addition, the invention relates to a corresponding substrate.

A method for applying a bonding layer that is comprised of a basic layer and a protective layer on a substrate with the following method steps: application of an oxidizable basic material as a basic layer on a bonding side of the substrate, at least partial covering of the basic layer with a protective material that is at least partially dissolvable in the basic material as a protective layer. In addition, the invention relates to a corresponding substrate.

A method for applying a bonding layer that is comprised of a basic layer and a protective layer on a substrate with the following method steps: application of an oxidizable basic material as a basic layer on a bonding side of the substrate, at least partial covering of the basic layer with a protective material that is at least partially dissolvable in the basic material as a protective layer. In addition, the invention relates to a corresponding substrate.