The present invention discloses chip packaging structure embodiments. The chip packaging structure may comprise a chip, at least one RF bonding plate, and a ground bonding plate. The ground bonding plate has at least one groove facing the at least one RF bonding plate; the RF bonding plate has a protruding section extending, with a gap, into one groove; an RF connection terminal on a front side of the chip reaches a back side of the chip through an RF metal via and connects to the protruding section of one RF bonding plate. Ground connection terminals on the front side of the chip reach the back side of the chip through ground metal vias and connect to the ground bonding plate. The present invention solves the problem of performance degradation in traditional WB packaging under high frequencies and high complexity and cost in FC packaging processes.