A method forming a bond wire connection includes providing a wire bonder including a bond wedge with a wire guide, and forming a wire bond loop by initially bonding a bond wire to a first bonding surface using the bond wedge, then moving the wire bonder in a loop pattern whereby the bond wire passes through the wire guide, and then bonding the bond wire to a second bonding surface using the bond wedge, wherein moving the wire bonder in the loop pattern comprises a retrograde movement whereby the wire bonder moves away from the second bonding surface, and wherein the wire guide is formed from a material with a higher material hardness than the bond wire.