Patent classifications
H01L31/0735
Resonant cavity enhanced (RCE) interband cascade (IC) photovoltaic (PV) device
A PV device comprises a first mirror comprising a reflectance of higher than 50%; a second mirror interface; and an optical cavity positioned between the first mirror and the second mirror interface and comprising at least one IC stage. Each of the at least one IC stage comprises a conduction band; a valence band; a hole barrier comprising a first band gap; an absorption region coupled to the hole barrier, comprising a second band gap that is less than the first band gap, and configured to absorb photons; and an electron barrier coupled to the absorption region so that the absorption region is positioned between the hole barrier and the electron barrier. The electron barrier comprises a third band gap that is greater than the second band gap. The PV device is configured to operate at a forward bias voltage with a net photon absorption for generating an electric output.
Resonant cavity enhanced (RCE) interband cascade (IC) photovoltaic (PV) device
A PV device comprises a first mirror comprising a reflectance of higher than 50%; a second mirror interface; and an optical cavity positioned between the first mirror and the second mirror interface and comprising at least one IC stage. Each of the at least one IC stage comprises a conduction band; a valence band; a hole barrier comprising a first band gap; an absorption region coupled to the hole barrier, comprising a second band gap that is less than the first band gap, and configured to absorb photons; and an electron barrier coupled to the absorption region so that the absorption region is positioned between the hole barrier and the electron barrier. The electron barrier comprises a third band gap that is greater than the second band gap. The PV device is configured to operate at a forward bias voltage with a net photon absorption for generating an electric output.
Method of fabricating multijunction solar cells for space applications
A method of fabricating a four junction solar cell having an upper first solar subcell composed of a semiconductor material including aluminum and having a first band gap; a second solar subcell adjacent to said first solar subcell and composed of a semiconductor material having a second band gap smaller than the first band gap and being lattice matched with the upper first solar subcell; a third solar subcell adjacent to said second solar subcell and composed of a semiconductor material having a third band gap smaller than the second band gap and being lattice matched with the second solar subcell; and a fourth solar subcell adjacent to and lattice matched with said third solar subcell and composed of a semiconductor material having a fourth band gap smaller than the third band gap; wherein the fourth subcell has a direct bandgap of greater than 0.75 eV.
FAST NEUTRON DETECTOR
Fast neutron detectors using nuclear reactions within semiconductor material, glass, or other material. Some versions used doped versions of the materials. Some versions use dopants selected from Ba, As, Br, C, Ce, Cl, Co, Cu, F, Ga, Ge, In, Cd, Te, Al, P, K, La, Mo, Nd, O, Os, Pr, S, Se, Si, Sn, Sr, Ti, TI, V, Zn, and Zr. Some versions have filters or coatings deposited on windows into the detector. Coatings are selected from titanium oxide, zinc oxide, tin oxide, copper indium gadolinium selenide, cadmium telluride, cadmium tin oxide, perovskite photovoltaic, Si, GaAs, AIP, Ge.
FAST NEUTRON DETECTOR
Fast neutron detectors using nuclear reactions within semiconductor material, glass, or other material. Some versions used doped versions of the materials. Some versions use dopants selected from Ba, As, Br, C, Ce, Cl, Co, Cu, F, Ga, Ge, In, Cd, Te, Al, P, K, La, Mo, Nd, O, Os, Pr, S, Se, Si, Sn, Sr, Ti, TI, V, Zn, and Zr. Some versions have filters or coatings deposited on windows into the detector. Coatings are selected from titanium oxide, zinc oxide, tin oxide, copper indium gadolinium selenide, cadmium telluride, cadmium tin oxide, perovskite photovoltaic, Si, GaAs, AIP, Ge.
Semi-polar III-nitride optoelectronic devices on m-plane substrates with miscuts less than +/− 15 degrees in the c-direction
An optoelectronic device grown on a miscut of GaN, wherein the miscut comprises a semi-polar GaN crystal plane (of the GaN) miscut x degrees from an m-plane of the GaN and in a c-direction of the GaN, where −15<x<−1 and 1<x<15 degrees.
Semi-polar III-nitride optoelectronic devices on m-plane substrates with miscuts less than +/− 15 degrees in the c-direction
An optoelectronic device grown on a miscut of GaN, wherein the miscut comprises a semi-polar GaN crystal plane (of the GaN) miscut x degrees from an m-plane of the GaN and in a c-direction of the GaN, where −15<x<−1 and 1<x<15 degrees.
SOLAR CELL DEVICE AND METHOD FOR PRODUCING THE SAME
A solar cell device includes a supporting substrate, and an epitaxial active structure that is disposed on the supporting substrate. The epitaxial active structure has a bottom surface adjacent to the supporting substrate and a top surface opposite to the bottom surface, and is formed with an isolation section that extends from the top surface to the bottom surface. A method for producing the solar cell device is also disclosed.
Self-bypass diode function for gallium arsenide photovoltaic devices
Embodiments of the invention generally relate to photovoltaic devices. In one embodiment, a method for forming a gallium arsenide based photovoltaic device includes providing a semiconductor structure, the structure including an absorber layer comprising gallium arsenide. A bypass function is provided in a p-n junction of the semiconductor structure, where under reverse-bias conditions the p-n junction breaks down in a controlled manner by a Zener breakdown effect.
Self-bypass diode function for gallium arsenide photovoltaic devices
Embodiments of the invention generally relate to photovoltaic devices. In one embodiment, a method for forming a gallium arsenide based photovoltaic device includes providing a semiconductor structure, the structure including an absorber layer comprising gallium arsenide. A bypass function is provided in a p-n junction of the semiconductor structure, where under reverse-bias conditions the p-n junction breaks down in a controlled manner by a Zener breakdown effect.