Patent classifications
H01L31/12
METHOD AND APPARATUS TO FACILITATE DIRECT SURFACE COOLING OF A CHIP WITHIN A 3D STACK OF CHIPS USING OPTICAL INTERCONNECT
In one embodiment, the disclosure relates to a system of stacked and connected layers of circuits that includes at least one pair of adjacent layers having very few physical (electrical) connections. The system includes multiple logical connections. The logical interconnections may be made with light transmission. A majority of physical connections may provide power. The physical interconnections may be sparse, periodic and regular. The exemplary system may include physical space (or gap) between the a pair of adjacent layers having few physical connections. The space may be generally set by the sizes of the connections. A constant flow of coolant (gaseous or liquid) may be maintained between the adjacent pair of layers in the space.
METHOD AND APPARATUS TO FACILITATE DIRECT SURFACE COOLING OF A CHIP WITHIN A 3D STACK OF CHIPS USING OPTICAL INTERCONNECT
In one embodiment, the disclosure relates to a system of stacked and connected layers of circuits that includes at least one pair of adjacent layers having very few physical (electrical) connections. The system includes multiple logical connections. The logical interconnections may be made with light transmission. A majority of physical connections may provide power. The physical interconnections may be sparse, periodic and regular. The exemplary system may include physical space (or gap) between the a pair of adjacent layers having few physical connections. The space may be generally set by the sizes of the connections. A constant flow of coolant (gaseous or liquid) may be maintained between the adjacent pair of layers in the space.
Sensing device
A sensing device includes a substrate, two chips, and a shielding structure. The two chips are respectively defined as an emitting chip and a receiving chip. The emitting chip can emit a sensing light beam, the receiving chip can receive the sensing light beam, and the two chips are fixed in position on the substrate at intervals. At least one of the chips is electrically connected to the substrate through at least one wire, and a position where the wire is connected to the substrate is located between the two chips. The shielding structure is formed on the substrate. The shielding structure is located between the two chips, and the shielding structure covers the wire and a portion of the chip connected to the wire. Compared with the conventional photo-plethysmography sensor, the sensing device has the advantage of a smaller size.
Sensing device
A sensing device includes a substrate, two chips, and a shielding structure. The two chips are respectively defined as an emitting chip and a receiving chip. The emitting chip can emit a sensing light beam, the receiving chip can receive the sensing light beam, and the two chips are fixed in position on the substrate at intervals. At least one of the chips is electrically connected to the substrate through at least one wire, and a position where the wire is connected to the substrate is located between the two chips. The shielding structure is formed on the substrate. The shielding structure is located between the two chips, and the shielding structure covers the wire and a portion of the chip connected to the wire. Compared with the conventional photo-plethysmography sensor, the sensing device has the advantage of a smaller size.
DISPLAY APPARATUS AND ELECTRONIC DEVICE
A display apparatus having a noncontact input function is provided. The display apparatus has a first function of detecting, with a light-receiving device, light irradiated from a light source outside a display portion and blocked by a pointing object to recognize the position pointed by the pointing object, and a second function of detecting, with the light-receiving device, light irradiated from a light source inside or outside the display portion and reflected by the pointing object to recognize the position pointed by the pointing object. The display apparatus can operate by switching the first function and the second function in accordance with the intensity of the light irradiated from the light source outside the display portion.
THREE-DIMENSIONAL PHOTOCONDUCTIVE TRANSDUCER FOR TERAHERTZ SIGNALS OR PICOSECOND ELECTRICAL PULSES
A photoconductive transducer intended to generate or detect waves in the terahertz frequency domain or in the picosecond pulse domain is provided. The transducer comprises a three-dimensional structure that includes, in this order, a first planar electrode, an array of nano-columns embedded in a layer of resist and a second planar electrode parallel to the first planar electrode. The design of the transducer increases the optical-to-terahertz conversion efficiency by means of photonic and plasmonic resonances and by means of high and homogeneous electric fields. The height of the nano-columns as well as the thickness of the resist range between 100 nanometres and 400 nanometres. The width of the nano-columns is between 100 nanometres and 400 nanometres, the distance between two adjacent nano-columns is between 300 nanometres and 500 nanometres, the nano-columns are made of a III-V semiconductor. The second electrode is transparent, so as to allow the transmission of a laser source towards the photo-absorbing nano-columns.
ELECTRONIC PACKAGE AND ELECTRONIC DEVICE
The present disclosure provides an electronic package. The electronic package includes a substrate, a first component disposed on the substrate and configured to detect an external signal, and an encapsulant disposed on the substrate. The electronic package also includes a protection element disposed on the substrate and physically separating the first device from the encapsulant and exposing the first device. The present disclosure also provides an electronic device.
ELECTRONIC PACKAGE AND ELECTRONIC DEVICE
The present disclosure provides an electronic package. The electronic package includes a substrate, a first component disposed on the substrate and configured to detect an external signal, and an encapsulant disposed on the substrate. The electronic package also includes a protection element disposed on the substrate and physically separating the first device from the encapsulant and exposing the first device. The present disclosure also provides an electronic device.
ELECTRONIC DEVICE FOR CALIBRATING ILLUMINANCE SENSOR
A portable electronic device includes a foldable housing; a display; an illuminance sensor; a state detection sensor; a memory; and a processor. Based on data received from the state detection sensor, the portable electronic device is recognized to be in the folded state. Responsive to the portable electronic device being in a calibration trigger state which includes the folded state, a first image is displayed in a sensor area of a first display area located on the illuminance sensor, and a second image is displayed in an area of the second display area facing the sensor area. An illuminance value is calculated based on data received from the illuminance sensor while the first image and the second image are displayed, and then compared to a reference value stored in the memory to calculate a calibration value for calibrating measured illuminance values of the illuminance sensor.
Display device
The disclosure relates to a display device which includes a substrate having a bent portion and a main portion, a plurality of pixels disposed on the main portion, an electrical circuit disposed on the bent portion, and a conductive layer disposed on the substrate. At least a portion of the electrical circuit overlaps the plurality of pixels along a direction perpendicular to the main portion. The conductive layer is electrically connected to at least one of the plurality of pixels and the electrical circuit, and the conductive layer has at least one opening.