A micro-LED display device and a manufacturing method thereof are disclosed. The method comprises: forming micro-LEDs (202) on a carrier substrate (201), wherein the carrier substrate (201) is transparent for a laser which is used in laser lifting-off; filling trenches between the micro-LEDs (202) on the carrier substrate (201) with a holding material (209); performing a laser lifting-off on selected ones of the micro-LEDs (202) to lift off them from the carrier substrate (201), wherein the selected micro-LEDs (202) are held on the carrier substrate (201) through the holding material (209); bonding the selected micro-LEDs (202) onto a receiving substrate (207) of the micro-LED display device; separating the selected micro-LEDs (202) from the carrier substrate (201) to transfer them to the receiving substrate (207).

A semiconductor ultraviolet light emitting device package is provided. The semiconductor ultraviolet light emitting device package includes: a semiconductor ultraviolet light emitting device mounted on the first surface of the package substrate and configured to emit deep ultraviolet light including a wavelength in a range of 250 nm to 285 nm; a reflector disposed on the first surface of the package substrate to surround the semiconductor ultraviolet light emitting device, and including an inclined sidewall that defines an opening of the reflector, the semiconductor ultraviolet light emitting device disposed within the opening; and a light transmitting cover including a lower surface covering the opening and an upper surface opposite to the lower surface, wherein an antireflective layer is disposed on at least one from among the lower surface and the upper surface.

A light-emitting device includes: a substrate; a light-emitting element disposed on the substrate; a light-transmissive member disposed on a light extraction surface of the light-emitting element; a cover that covers the light-emitting element with a gap between the cover and the light-emitting element, the cover including: an upper portion that is transmissive to light emitted from the light-emitting element, a sidewall extending along a peripheral edge of the upper portion and having an outer lateral surface, and a recess defined by the upper portion and the sidewall; and a fixing member arranged on at least a part of the outer lateral surface of the sidewall of the cover. The fixing member is formed of a material that is deformable due to a pressing force generated in the event of an engagement with a counterpart member.

A method of manufacturing a light emitting device includes: providing a substantially flat plate-shaped base member which in plan view includes at least one first portion having an upper surface, and a second portion surrounding the at least one first portion and having inner lateral surfaces; mounting at least one light emitting element on the at least one first portion; shifting a relative positional relationship between the at least one first portion and the second portion in an upper-lower direction to form at least one recess defined by an upper surface of the at least one first portion that serves as a bottom surface of the at least one recess and at least portions of the inner lateral surfaces of the second portion that serve as lateral surfaces of the at least one recess; and bonding the at least one first portion and the second portion with each other.

A light-emitting apparatus includes a supporting element, a light-emitting device, and a connecting pin. The light-emitting device has a pair of conductive pads and is disposed on the supporting element. The connecting pin is inserted from the side surface of the supporting element and electrically connected to one of the conductive pads. The topmost surface of the supporting element is lower than the top surface of the light-emitting device.

A light emitting device including a blue light emitting portion configured to emit blue light, a green light emitting portion configured to emit green light, a red light emitting portion configured to emit red light, in which the blue light emitting portion include a first near-UV light emitting diode chip and a first wavelength conversion portion for wavelength conversion of near-UV light emitted from the first near-UV light emitting diode chip, blue light emitted from the blue light emitting portion includes a first peak wavelength in a wavelength band corresponding to near-UV light and a second peak wavelength in a wavelength band corresponding to blue light, and an intensity of the first peak wavelength is in a range of 0% to 20% of intensity of the second peak wavelength.

A method of manufacturing a metal structure for an optical semiconductor device, including a treatment step (1) of immersing in and/or applying the solution containing a polyallylamine polymer a base body, the base body including an outermost layer at a portion or entire surfaces of the base body, the outermost layer including a plating of at least one selected from the group consisting of gold, silver, a gold alloy, and a silver alloy, so as to manufacture the metal structure for an optical semiconductor device having an increased adhesion to a resin material.

A sterilization module including a main body including an ultraviolet outlet, a transparent member disposed on the ultraviolet outlet to transmit ultraviolet light, and a light source unit irradiating ultraviolet light toward the transparent member, and a sealing member, in which the light source unit includes a circuit board and a light emitting diode chip mounted thereon and including an epitaxial substrate, a conductive semiconductor layer electrically connected to the circuit board directly by an electrode, ultraviolet light is c irradiated toward the transparent member by passing through the epitaxial substrate, the sealing member is disposed between the transparent member and the circuit board, and a distance between the transparent member and the circuit board spaced apart from each other by the sealing member is greater than a height of the light emitting diode chip.

An LED packaging device includes a frame including a bottom wall having a bottom surface and a surrounding wall extending upwardly from the bottom wall, at least one LED chip, a plurality of spaced-apart reflectors and a packaging body. The bottom and surrounding walls cooperatively define a mounting space. The surrounding wall has an internal side surface facing the mounting space and a top surface facing away from the bottom surface. The LED chip is disposed on the bottom surface and is received in the mounting space. Each of the reflectors is disposed on a peripheral region of the bottom surface. The packaging body covers the LED chip and the reflectors, such that the LED chip is sealed inside the mounting space.

A light irradiation unit includes a substrate having a longitudinal direction, the longitudinal direction being a first axis direction; multiple light sources arranged along the first axis direction on a first surface of the substrate; a heat dissipation member arranged on a second surface of the substrate opposite to the first surface; and a housing having a pair of first side surfaces holding the heat dissipation member therebetween in a second axis direction orthogonal to the first axis direction along the first surface. The substrate has, at an end portion in the first axis direction, an end surface intersecting the first axis direction. The location of the end surface in the first axis direction is near an edge of the first side surface along the first axis direction. The end surface is exposed from the housing or covered by a detachable protection member.