Provided is a light emitting device that is bright in both scotopic vision and photopic vision, and has reduced glare for humans.

The light emitting device includes a light emitting element having a dominant wavelength in a range of 430 nm or more and 500 nm or less, and a fluorescent material that is excited by light emitted from the light emitting element and has a light emission peak wavelength in a range of 507 nm or more and 660 nm or less, wherein the light emitting device emits light having a dominant wavelength in a range of 490 nm or more and 500 nm or less, wherein the light emitting device has an S/P ratio, which is the ratio of a luminous flux in photopic vision to a luminous flux in scotopic vision, being 6.5 or less, and wherein the light emitting device has a light emission intensity in the light emission peak wavelength of the light emitting element that is greater than that in the light emission peak wavelength of the fluorescent material.

Provided are a color converting substrate and a display device including same. The color converting substrate includes: a base portion in which a first light transmission area, a first light blocking area, and a second light transmission area, which are sequentially and closely arranged in a first direction, are defined; a first wavelength converting pattern located on the base portion and configured to wavelength-covert a first color light into a second color light; a second wavelength converting pattern located on the base portion and configured to wavelength-convert the first color light into a third color light; and a light transmission pattern located on the base portion and configured to transmit the first color light.

A display apparatus includes: a light-emitting device layer provided to extend over a plurality of pixels arranged two-dimensionally; a phosphor layer separated by a partition wall for each of the pixels; and a bonding structure sandwiched between the light-emitting device layer and the phosphor layer, and in which a first oxidation film, a bonding oxidation film, and a second oxidation film are stacked in order from the light-emitting device layer side.

A black matrix substrate assembly including a transparent substrate, a black matrix pattern, a transparent resin layer, a resin wall pattern, a light reflective layer, and a transparent protective layer. The black matrix pattern includes first and second black linear segments with a width Ax of each first segment in a first direction. The resin wall pattern includes first and second wall linear segments with a width Dx of each first segment smaller than the width Ax in the first direction and the center line of each first segment aligned with that of the corresponding first black linear segment. The light reflective layer includes first and second reflective linear segments with a width Cx of each first segment larger than the width Dx in the first direction and the center line of each first segment aligned with that of the corresponding first black linear segment.

A light emitting diode package includes: a housing including a cavity region therein; a light emitting diode chip mounted in the cavity region of the housing; and a resin part formed in the cavity region to cover a light emitting surface of the light emitting diode chip. The housing includes a first surface and a second surface perpendicular to a width direction of the housing and spaced apart from each other, and a third surface and a fourth surface perpendicular a longitudinal direction of the housing and spaced apart from each other, in which the first surface and the second surface surround the resin part while the third surface and the fourth surface expose side surfaces of the resin part.

A light emitting diode package includes: a housing including a cavity region therein; a light emitting diode chip mounted in the cavity region of the housing; and a resin part formed in the cavity region to cover a light emitting surface of the light emitting diode chip. The housing includes a first surface and a second surface perpendicular to a width direction of the housing and spaced apart from each other, and a third surface and a fourth surface perpendicular a longitudinal direction of the housing and spaced apart from each other, in which the first surface and the second surface surround the resin part while the third surface and the fourth surface expose side surfaces of the resin part.

An object is to provide a new type of near-infrared ray-emitting phosphor which exhibits excellent emission intensity. A near-infrared ray-emitting phosphor is represented by a general formula, (Y, Lu, Gd).sub.3-x-y (Ga,Al,Sc).sub.5O.sub.12:(Cr.sub.x,(Yb,Nd).sub.y) (0.05<x<0.3, 0≤y<0.3).

A package includes a first lead including a first electrode terminal, a second lead including a second electrode terminal, a first molded body holding the first lead, and a second molded body holding the second lead. The second lead is provided on the first lead in an overlapping direction such that the first electrode terminal of the first lead overlaps with the second electrode terminal of the second lead when viewed in the overlapping direction. The first electrode terminal and the second electrode terminal are electrically connected to each other without adding additional material. A part of the first molded body and a part of the second molded body are in contact with each other.

An LED light source unit for plant cultivation includes: at least one first light emitting diode chip emitting light of 430 nm or less, at least three types of phosphors excited by the at least one first light emitting diode chip, and combined light emitted from the first light emitting diode chip and the at least three types of phosphors produces a basic spectrum of white light having a color temperature of 5000K or more.

A method of manufacturing an optoelectronic device, including the steps of: forming, on a first surface of a first including assemblies of electronic components, a stack of insulating layers and of conductive tracks; forming, on another wafer, light-emitting diodes each comprising ends; forming a metal layer on at least a portion of the surface of the first wafer and another metal layer on at least a portion of the surface of the second wafer, the other metal layer being electrically coupled to the end of each light-emitting diode; placing into contact the metal layers; forming an insulated conductive via connecting another surface of the wafer to a conductive track; and forming insulated conductive trenches surrounding diodes.