A bottom-emission light-emitting diode (LED) display includes a transparent substrate, a plurality of LEDs bonded on the substrate, a packaging layer formed on the substrate to cover the LEDs, and a reflecting layer formed on the packaging layer to reflect light emitted by the plurality of LEDs. The reflecting layer has a non-smooth shape or the packaging layer has different refractivities.

Enhanced probe cards, for testing unpackaged semiconductor die including numerous discrete devices (e.g., LEDs), are described. The die includes anodes and cathodes for the LEDs. Via a single touchdown event, the probe card may simultaneously operate each of the LEDs. The LEDs' optical output is measured and the performance of the die is characterized. The probe card includes a conductive first contact and another contact that are fabricated from a conformal sheet or film. Upon the touchdown event, the first contact makes contact with each of the die's anodes and the other contact makes contact with each of the die's cathodes. The vertical and sheet resistance of the contacts are sufficient such that the voltage drop across the vertical dimension of the contacts is approximately an order of magnitude greater than the operating voltage of the LEDs and current-sharing between adjacent LEDs is limited by the sheet resistance.

Lighting systems that include an LED and a silicone module designed to contain a lens are described herein.

A preparation method of a display panel includes: forming multiple compensation groups on a substrate to obtain an array substrate, where the multiple compensation groups include at least first compensation group and second compensation group, and brightness difference of light-emitting elements of same light-emitting color in the first compensation group and the second compensation group under a same gray scale is larger than a preset value; calculating thicknesses of first color film layer, second color film layer and third color film layer corresponding to each of the multiple compensation groups respectively; forming the first color film layer, the second color film layer and the third color film layer on light-emitting side of the first light-emitting element, the second light-emitting element, and the third light-emitting element respectively according to the thicknesses of the first color film layer, the second color film layer and the third color film layer obtained by calculation.

A method for manufacturing a light emitting module includes: providing a light source including a first surface having a pair of electrodes, and a second surface; providing a light guide plate including a first main surface and a second main surface, the light guide plate defining a through-hole extending through the light guide plate from the first main surface to the second main surface, the through-hole having a first penetration portion disposed on a first main surface side, a second penetration portion disposed on a second main surface side, and an intermediate penetration portion connecting the first penetration portion and the second penetration portion, the intermediate penetration portion being narrower in width than the second surface of the light source; and disposing the light source in the second penetration portion of the light guide plate with a joining member being interposed between the light source and the light guide plate.

A method for manufacturing a light emitting module includes: providing a light source including a first surface having a pair of electrodes, and a second surface; providing a light guide plate including a first main surface and a second main surface, the light guide plate defining a through-hole extending through the light guide plate from the first main surface to the second main surface, the through-hole having a first penetration portion disposed on a first main surface side, a second penetration portion disposed on a second main surface side, and an intermediate penetration portion connecting the first penetration portion and the second penetration portion, the intermediate penetration portion being narrower in width than the second surface of the light source; and disposing the light source in the second penetration portion of the light guide plate with a joining member being interposed between the light source and the light guide plate.

Provided is a light-emitting device with reduced in-plane luminance variation. The light-emitting device includes a main substrate, a plurality of light sources, a plurality of lenses, and one or more light reflection members. The main substrate includes a central part and a peripheral part that surrounds the central part. The plurality of light sources are each disposed on the central part of the main substrate. The plurality of lenses are disposed to correspond to the plurality of light sources respectively. The plurality of lenses apply optical effects to beams of light from the plurality of light sources respectively. One or more light reflection members are each disposed on the peripheral part. The light reflection members each have reflectance that is higher than the reflectance of the main substrate.

Metasurface elements, integrated systems incorporating such metasurface elements with light sources and/or detectors, and methods of the manufacture and operation of such optical arrangements and integrated systems are provided. Systems and methods for integrating transmissive metasurfaces with other semiconductor devices or additional metasurface elements, and more particularly to the integration of such metasurfaces with substrates, illumination sources and sensors are also provided. The metasurface elements provided may be used to shape output light from an illumination source or collect light reflected from a scene to form two unique patterns using the polarization of light. In such embodiments, shaped-emission and collection may be combined into a single co-designed probing and sensing optical system.

A curved FPA comprises an array of detectors, with mesas etched between the detectors such that they are electrically and physically isolated from each other. Metallization deposited at the bottom of the mesas reconnects the detectors electrically and thereby provides a common ground between them. Strain induced by bending the FPA into a curved shape is across the metallization and any backfill epoxy, rather than across the detectors. Indium bumps are evaporated onto respective detectors for connection to a readout integrated circuit (ROIC). An ROIC coupled to the detectors is preferably thinned, and the backside of the ROIC may also include mesas such that the ROIC is reticulated.

A curved FPA comprises an array of detectors, with mesas etched between the detectors such that they are electrically and physically isolated from each other. Metallization deposited at the bottom of the mesas reconnects the detectors electrically and thereby provides a common ground between them. Strain induced by bending the FPA into a curved shape is across the metallization and any backfill epoxy, rather than across the detectors. Indium bumps are evaporated onto respective detectors for connection to a readout integrated circuit (ROIC). An ROIC coupled to the detectors is preferably thinned, and the backside of the ROIC may also include mesas such that the ROIC is reticulated.