Patent classifications
H01L33/62
DISPLAY DEVICE USING LIGHT-EMITTING DIODE
A display device includes LEDs, a circuit board, an insulating layer, conductive posts, a control conductive plate, and a common conductive strip. The circuit board includes first pads and a second pad surrounding the first pads. The LEDs are on an insulating layer covering the first pads, each including a first and second electrode pad. The conductive posts are on and connected to a first portion of the first pads, and penetrate the insulation layer. The control conductive plate is electrically connected to one of the first electrode pads and the conductive posts. The common conductive strip is on the insulation layer and electrically connected to the second pad and a second electrode pad. Each first electrode pad is electrically connected to the first pads. A second portion of the first pads is completely covered by the insulation layer and overlapped with the common conductive strip and the insulation layer.
DISPLAY DEVICE USING LIGHT-EMITTING DIODE
A display device includes LEDs, a circuit board, an insulating layer, conductive posts, a control conductive plate, and a common conductive strip. The circuit board includes first pads and a second pad surrounding the first pads. The LEDs are on an insulating layer covering the first pads, each including a first and second electrode pad. The conductive posts are on and connected to a first portion of the first pads, and penetrate the insulation layer. The control conductive plate is electrically connected to one of the first electrode pads and the conductive posts. The common conductive strip is on the insulation layer and electrically connected to the second pad and a second electrode pad. Each first electrode pad is electrically connected to the first pads. A second portion of the first pads is completely covered by the insulation layer and overlapped with the common conductive strip and the insulation layer.
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
A display device includes a pixel electrode disposed on a substrate and including a reflective electrode layer and an upper electrode layer, a contact electrode disposed on the pixel electrode, light-emitting elements disposed on the contact electrode and disposed perpendicular to the pixel electrode, a planarization layer disposed on the pixel electrode, the planarization layer filling a space between the light-emitting elements, and a common electrode disposed on the planarization layer and the light-emitting elements, and a size of the contact electrode is equal to a size of each of the light-emitting elements in a plan view, and the upper electrode layer is disposed on the reflective electrode layer and is in a polycrystalline phase.
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
A display device includes a pixel electrode disposed on a substrate and including a reflective electrode layer and an upper electrode layer, a contact electrode disposed on the pixel electrode, light-emitting elements disposed on the contact electrode and disposed perpendicular to the pixel electrode, a planarization layer disposed on the pixel electrode, the planarization layer filling a space between the light-emitting elements, and a common electrode disposed on the planarization layer and the light-emitting elements, and a size of the contact electrode is equal to a size of each of the light-emitting elements in a plan view, and the upper electrode layer is disposed on the reflective electrode layer and is in a polycrystalline phase.
DISPLAY DEVICE
A display device including: a substrate including pixel electrodes; a passivation layer on the substrate, a groove in the passivation layer between the pixel electrodes;
contact electrodes on the pixel electrodes; and a light-emitting element layer comprising a plurality of light-emitting elements respectively bonded onto the contact electrodes and having a plurality of semiconductor layers thereon. The groove does not overlap the plurality of light-emitting elements.
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
Disclosed are an electronic device and a manufacturing method of an electronic device. The manufacturing method includes the following. A first substrate is provided. The first substrate includes a plurality of chips. A second substrate is provided. A transfer process is performed to sequentially transfer a first chip and a second chip among the chips to the second substrate. The second chip is adjacent to the first chip. A first angle is between a first extension direction of a first side of the first chip and an extension direction of a first boundary of the second substrate. A second angle is between a second extension direction of a second side of the second chip and the extension direction of the first boundary of the second substrate. The first angle is different from the second angle.
APPARATUS AND METHOD OF MANUFACTURING DISPLAY USING LIGHT EMITTING ELEMENT
Discussed is an apparatus and a method of manufacturing a display using a micro light emitting diode (LED). A method of manufacturing a display device using a light emitting element includes providing a substrate having an individual pixel position defined by a pair of assembly electrodes; moving the light emitting element including a magnetic body on to the substrate using a magnetic chuck having an electromagnet; assembling the light emitting element at the individual pixel position using the magnetic chuck; and recovering a remaining light emitting element which is not assembled at the individual pixel position using the magnetic chuck.
APPARATUS AND METHOD OF MANUFACTURING DISPLAY USING LIGHT EMITTING ELEMENT
Discussed is an apparatus and a method of manufacturing a display using a micro light emitting diode (LED). A method of manufacturing a display device using a light emitting element includes providing a substrate having an individual pixel position defined by a pair of assembly electrodes; moving the light emitting element including a magnetic body on to the substrate using a magnetic chuck having an electromagnet; assembling the light emitting element at the individual pixel position using the magnetic chuck; and recovering a remaining light emitting element which is not assembled at the individual pixel position using the magnetic chuck.
DISPLAY APPARATUS USING SEMICONDUCTOR LIGHT-EMITTING DEVICE
The present invention relates to a display apparatus, specifically to a display apparatus using semiconductor light-emitting elements of a few micrometers to tens of micrometers in size. The present invention provides a display apparatus comprising: a base part; a partition part having a plurality of grooves; a plurality of semiconductor light-emitting elements arranged on the base part and mounted in the plurality of grooves; first and second wiring electrodes arranged on one side and the other side of each of the semiconductor light-emitting elements, respectively; an assembly electrode arranged on the base part and arranged on the one side of each of the semiconductor light-emitting elements; and a dielectric layer arranged on the base part and arranged between the assembly electrode and the first wiring electrode, wherein each of the plurality of grooves includes at least one recess portion formed in the horizontal direction with respect to the base part.
DISPLAY APPARATUS USING SEMICONDUCTOR LIGHT-EMITTING DEVICE
The present invention relates to a display apparatus, specifically to a display apparatus using semiconductor light-emitting elements of a few micrometers to tens of micrometers in size. The present invention provides a display apparatus comprising: a base part; a partition part having a plurality of grooves; a plurality of semiconductor light-emitting elements arranged on the base part and mounted in the plurality of grooves; first and second wiring electrodes arranged on one side and the other side of each of the semiconductor light-emitting elements, respectively; an assembly electrode arranged on the base part and arranged on the one side of each of the semiconductor light-emitting elements; and a dielectric layer arranged on the base part and arranged between the assembly electrode and the first wiring electrode, wherein each of the plurality of grooves includes at least one recess portion formed in the horizontal direction with respect to the base part.