An electrical converter and heater module with heat insulators having different cross-sectional areas includes a thermoelectric conversion module that corrects the difference in thermal resistance between a P-type thermoelectric conversion member and an N-type thermoelectric conversion member. In this thermoelectric conversion module, since insulators included in the P-type thermoelectric conversion member and the N-type thermoelectric conversion member have a different thermal resistance, it is possible to correct the difference in thermal resistance between the P-type thermoelectric conversion element and the N-type thermoelectric conversion element.

An active metamaterial array of the present disclosure includes: a substrate; a plurality of metamaterial structures disposed on the substrate and spaced apart from each other; a conductivity variable material layer formed between each of the plurality of the metamaterial structures so as to selectively connect the metamaterial structures; an electrolyte material layer formed on the metamaterial structures and the conductivity variable material layer; and a gate electrode disposed at one end of the substrate so as to be in contact with one region of the electrolyte material layer, and when an external voltage is applied to the gate electrode, the gate electrode changes the conductivity of the conductivity variable material layer by controlling the migration of ions contained in the electrolyte material layer.

The present application provides a pixel circuit, a display panel, and a temperature compensation method for a display panel. The display panel includes a plurality of pixel units. At least one of the plurality of pixel units includes: a display layer comprising a light emitting element; and a thermoelectric conversion layer comprising a thermoelectric element having a first terminal and a second terminal, wherein the first terminal is disposed adjacent to the light emitting element and in thermal contact with the light emitting element, and the second terminal is disposed away from the light emitting element. The thermoelectric element has a first signal terminal and a second signal terminal, and is configured to generate a temperature difference voltage signal between the first signal terminal and the second signal terminal according to a temperature difference between the first terminal and the second terminal.

Exemplary thermoelectric devices and methods are disclosed herein. Thermoelectric generator performance is increased by the shaping isothermal fields within the bulk of a thermoelectric pellet, resulting in an increase in power output of a thermoelectric generator module. In one embodiment, a thermoelectric device includes a pellet comprising a semiconductor material, a first metal layer surrounding a first portion of the pellet, and a second metal layer surrounding a second portion of the pellet. The first and second metal layers are configured proximate to one another about a perimeter of the pellet. The pellet is exposed at the perimeter. And the perimeter is configured at a sidewall height about the pellet to provide a non-linear effect on a power output of the thermoelectric device by modifying an isotherm surface curvature within the pellet. The device also includes a metal container thermally and electrically bonded to the pellet.

A thermoelectric cooler, a method for preparing a thermoelectric cooler, and an electronic device. The thermoelectric cooler includes two monocrystalline silicon substrates disposed opposite to each other and a plurality of semiconductor thermoelectric particles located between the two monocrystalline silicon substrates. An insulation layer is provided on a side that is of a monocrystalline silicon substrate and that faces the semiconductor thermoelectric particles. A conductive sheet is provided between the insulation layer and the semiconductor thermoelectric particles, and the conductive sheet is electrically connected to the semiconductor thermoelectric particles, so that the semiconductor thermoelectric particles form a serial connection circuit.

A thermoelectric device includes active elements containing thermoelectric materials of silicon, an alloy of silicon, a metal-silicide or silicon composite and an interconnection zone consisting of a metal interconnect and a re-crystallized phase consisting of material from the active thermoelectric elements. The metal interconnect is from a metal that does not form metal silicides in a solid state, has a certain solubility for components of the thermoelectric elements in the liquid phase and a low solubility of these components in the solid phase. The active thermoelectric elements are shaped with a first and a second contact interface. The interconnection between the different thermoelectric elements consists of at least two phases of material, one of which is mainly the metallic interconnection material, the other is formed by the re-crystallized components of the thermoelectric materials.

A thermoelectric device with multiple headers and a method of manufacturing such a device are provided herein. In some embodiments, a thermoelectric device includes multiple thermoelectric legs, a cold header thermally attached to the thermoelectric legs, and a hot header thermally attached to the thermoelectric legs opposite the cold header. At least one of the cold header and the hot header includes at least one score line. According to some embodiments disclosed herein, this the thermal stress on the thermoelectric device can be greatly reduced or relieved by splitting the header into multiple pieces or by scoring the header by a depth X. This enables the use of larger thermoelectric devices and/or thermoelectric devices with an increased lifespan.

The present disclosure relates to a photoelectric conversion apparatus. The photoelectric conversion apparatus includes a carbon nanotube layer, a first thermoelectric conversion layer, a second thermoelectric conversion layer, a first electrode and a second electrode. The carbon nanotube layer includes a plurality of carbon nanotubes. An areal density of the carbon nanotube layer is in a range from about 0.16 g/m.sup.2 to about 0.32 g/m.sup.2.

A flexible Peltier device in which emitting heat conversion properties between Peltier elements and an object transferring heat may be improved and a flexible heat-emitting sheet having the Peltier elements bonded thereto may be bent without worrying the separation there between. A flexible Peltier device includes a single or plural Peltier element which is disposed on one surface side of a heat-emitting sheet having flexibility made from heat-conductive rubber containing a heat conductive filler and each semiconductor element which has a heating side and a cooling side and composes the Peltier element at least one of the heating side and the cooling side is bonded integrally to the heat-emitting sheet by a direct covalent bond and/or by an indirect covalent bond through a molecular adhesive at active groups existing on each other surfaces.

An an apparatus for manufacturing a thermoelectric module is provided. The apparatus includes a thermoelectric element interposed between a lower substrate that includes a lower electrode and an upper substrate that includes an upper electrode. Additionally, the apparatus includes a first block that is configured to support the lower substrate and a second block that is configured to move vertically with respect to the first block and support the upper substrate. A jig is configured to position the thermoelectric element in connection with the upper electrode and the lower electrode.